component
TMI3343B
Public Made by Adomby adom
TMI DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTMI3343B
TMI · DC-DC Converters · ESOP-8
TMI3343B from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | High-side gate driver bootstrap pin that supplies the high-side LDMOS gate driver; connect a 100nF capacitor between BS and SW. |
| 2 | IN | power_in | Power input pin, with recommended VIN range of 4.5V to 30V and input overvoltage protection typically at 32V. |
| 3 | SW | output | Switch pin connected to the external inductor; the high-side switch drives it toward IN and the low-side switch returns it to GND. |
| 4 | GND | power_in | Ground pin; the datasheet recommends returning FB, COMP and RT to this signal ground and joining it to power GND at a single point. |
| 5 | FB | input | Feedback pin regulated to the internal 0.8V reference, with a feedback threshold of 784mV to 816mV. |
| 6 | COMP | passive | External compensation pin for the peak current mode control loop. |
| 7 | EN | input | Drive to logic high to enable the IC and logic low to enter micro-power shutdown; do not leave floating, and keep the pull-up EN sink current below 1mA when pulled up to VIN through a resistor. |
| 8 | RT | passive | Connect an external resistor from RT to GND to set the switching frequency, which is adjustable from 50kHz to 1.5MHz. |
| 9 | GND | power_in | Exposed pad ground that should be connected to the power ground copper area with copper and vias for heat dissipation and noise immunity. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, SW | -0.3 | 33 | V | 2 | |||
| BS to SW Voltage | -0.3 | 6 | V | 2 | |||
| All Other Pins (FB, EN, RT, COMP) Voltage | -0.3 | 6 | V | 2 | |||
| Storage Temperature Range | -50 | 150 | °C | 2 | |||
| Junction Temperature | -40 | 150 | °C | 2 | |||
| Voltage Range | VIN | 4.5 | 30 | V | 3 | ||
| Input Voltage Range | VIN | 4.5 | 30 | V | 4 | ||
| Feedback Threshold Voltage | VFBTH | 784 | 800 | 816 | mV | PWM operation | 4 |
| EN Rising Threshold | 1 | 1.15 | 1.3 | V | 4 | ||
| FB Pin input current | IFB | -50 | 50 | nA | 4 | ||
| Input Quiescent Current | IQ | 0.38 | 0.48 | mA | VFB=1V | 4 | |
| Shutdown Current | ISD | 3 | 10 | μA | EN = 0V | 4 | |
| Maximum Duty-cycle | DMAX | 91 | % | 4 | |||
| Under Voltage Lockout | VUVLO | 4.3 | V | VIN rising | 4 | ||
| UVLO Hysteresis | VUVLO_HY | 0.35 | V | 4 | |||
| Input OVP Voltage | VINOVP | 32 | V | 4 | |||
| Input Supply Current | IIN | 0.45 | mA | No load | 4 | ||
| EN Hysteresis | 100 | mV | 4 | ||||
| EN sink current | IEN_Sink | 1 | mA | 4 | |||
| Soft start time | TSS | 1.4 | ms | 4 | |||
| High-side cycle-by-cycle current limit | ILIM_MAX | 4.2 | A | 4 | |||
| SW leakage | ISW_LEAK | 10 | μA | 4 | |||
| Switch On-Resistance (high side) | RDSON_H | 120 | mΩ | 4 | |||
| Switch On-Resistance (low side) | RDSON_L | 80 | mΩ | 4 | |||
| Switching Frequency | FSW | 1050 | kHz | RT=50kΩ | 4 | ||
| Switching Frequency | FSW | 345 | kHz | RT=150kΩ | 4 | ||
| Switching Frequency | FSW | 105 | kHz | RT=500kΩ | 4 | ||
| Minimum Turn-on Time | TON_MIN | 200 | ns | 4 | |||
| FB UV Threshold to Hiccup | VUV | 35 | % of VREF | VFB refers to VREF | 4 | ||
| Hiccup on Time | 2 | ms | 4 | ||||
| Hiccup Time Before Restart | 64 | ms | 4 | ||||
| Thermal Shutdown Threshold | TSDN | 160 | °C | 4 | |||
| Thermal Shutdown Hysteresis | TSDN_HY | 10 | °C | 4 | |||
| Junction-to-ambient thermal resistance | θJA | 60 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
TMI3343B - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
tmi3343b-etched.step/tmi3343b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tmi3343b.step/tmi3343b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TMI datasheet (15 pp, sha256
3b83b19504c02345, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).