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README

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STF15NM65N

STMicroelectronics · MOSFETs · TO-220F-3

STF15NM65N from STMicroelectronics, in a TO-220F-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±25 V with a typical threshold of 3 V (2 V min, 4 V max) at ID = 250 µA.
2 D passive Drain; drain-source voltage rated 650 V, continuous drain current 12 A at Tc = 25 °C, pulsed 48 A.
3 S passive Source; source-drain diode current is 12 A continuous and 48 A pulsed.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package TO-220F-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain source voltage VDS 650 V 3
Gate source voltage VGS -25 25 V 3
Drain current continuous ID 12 A Tc = 25 °C; limited by maximum junction temperature 3
Drain current continuous ID 7.56 A Tc = 100 °C 3
Drain current pulsed IDM 48 A Pulse width limited by safe operating area 3
Total dissipation PTOT 30 W Tc = 25 °C 3
Peak diode recovery voltage slope dv/dt 15 V/ns ISD ≤12 A, di/dt ≤ 400 A/µs, VDSpeak ≤ V(BR)DSS, VDD = 80 % V(BR)DSS 3
Insulation withstand voltage (RMS from all three leads to external heatsink) VISO 2500 V t = 1 s; TC = 25 °C 3
Operating junction temperature range TJ -55 150 °C 3
Avalanche current, repetitive or non-repetitive IAS 3 A Pulse width limited by Tjmax 3
Single pulse avalanche energy EAS 187 mJ Starting TJ = 25 °C, ID = IAR, VDD = 50 V 3
Thermal resistance junction-case Rthjc 4.17 °C/W 3
Thermal resistance junction-ambient Rthj-amb 62.5 °C/W 3
Drain-source breakdown voltage V(BR)DSS 650 V VGS = 0, ID = 1 mA 4
Zero gate voltage drain current IDSS 1 µA VDD = 650 V, VGS = 0 4
Zero gate voltage drain current IDSS 100 µA VDD = 650 V, VGS = 0, TC = 125 °C (defined by design, not subject to production test) 4
Gate body leakage IGSS -100 100 nA VGS = ±25 V, VDS = 0 V 4
Gate threshold voltage VGS(th) 2 3 4 V ID = 250 µA, VGS = VDS 4
Static drain-source on-resistance RDS(on) 0.35 0.38 Ω ID = 6 A, VGS = 10 V 4
Source drain current ISD 12 A 5
Source drain current (pulsed) ISDM 48 A Pulse width limited by safe operating area 5
Forward on voltage VSD 1.6 V ISD = 12 A, VGS = 0 V; pulsed: pulse duration = 300 µs, duty cycle 1.5 % 5
Reverse recovery time trr 428 ns ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V 5
Reverse recovery charge Qrr 4.7 µC ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V 5
Reverse recovery current IRRM 21.5 A ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V 5
Reverse recovery time trr 570 ns ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C 5
Reverse recovery charge Qrr 6.2 µC ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C 5
Reverse recovery current IRRM 22 A ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C 5

CAD (KiCad official)

  • Symbol: STF15NM65N
  • Footprint: Package_TO_SOT_THT:TO-220F-3_Vertical
  • 3D model: TO-220F-3 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (15 pp, sha256 fddcc01c1e4c3423, retrieved 2026-10-15, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF