component
FM8002E
Public Made by Adomby adom
Shenzhen Fuman Audio Power OpAmps, SOP-8-150mil. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownFM8002E
Shenzhen Fuman · Audio Power OpAmps · SOP-8-150mil
FM8002E from Shenzhen Fuman, in a SOP-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Shutdown control input. Drive high (=VDD) to disable the amplifier and drop supply current to ~4.2 µA; drive low to enable normal operation. Must be driven to a valid logic level (a pull-up resistor is recommended when driven by a single-pole switch). |
| 2 | BYPASS | passive | Internal bias voltage reference (VDD/2) bypass node. Connect a 1.0 µF capacitor (CB) to GND as close as possible to the device to stabilize the internal bias and improve PSRR. Larger capacitance further improves PSRR. |
| 3 | +IN | input | Non-inverting audio input of the first op-amp. Typically biased to VDD/2 via the internal Bypass network in the standard inverting-gain configuration. |
| 4 | -IN | input | Inverting audio input of the first op-amp. Connect via Ci (0.1-0.39 µF) to the audio source and via Rf to VO1; closed-loop differential gain is AVD = 2 × (Rf/Ri). |
| 5 | VO1 | output | BTL speaker output 1 (positive side of the bridge). Drives one terminal of the load (typ. 4-8 Ω); no external DC-blocking capacitor is required. |
| 6 | VDD | power_in | Positive supply. Operating range 1.6 V to 6 V (typ. 5 V); decouple with a 1.0 µF tantalum capacitor (Cs) to GND close to the pin. |
| 7 | GND | power_in | Device ground return. Connect to the system analog ground plane. |
| 8 | VO2 | output | BTL speaker output 2 (negative side of the bridge). Driven by the internal fixed-gain second op-amp 180° out of phase with VO1 to double the swing across the load. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | SOP-8-150mil |
| Category | Op-amp/Cmp |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 工作电压 (operating supply voltage) | VDD | 1.6 | 6 | V | 3 | ||
| 输出失调电压 (output offset voltage) | VOS | 3.7 | 20 | mV | 3 | ||
| 输出电阻 (output resistance) | RO | 7 | 8.5 | 10 | KΩ | 3 | |
| 总谐波+失真噪声 (THD+N) | THD+N | 0.1 | 0.2 | % | PO=0.5Wrms；f=1KHZ | 3 | |
| 电源电压抑制比 PSRR (minimum) | PSRR | 60 | dB | Vripple=200mVPP，正弦波，输入接 10Ω电阻 | 3 | ||
| 输入耦合电容 Ci (recommended) | Ci | 0.1 | 0.39 | uF | 文中推荐值，CBy=1uF 时满足系统性能要求 | 2 | |
| 电源电压 (absolute maximum) | VDD | 6 | V | Ta=25℃ | 3 | ||
| 工作温度 (operating temperature) | TOPR | -40 | 85 | ℃ | 3 | ||
| 环境温度 (ambient temperature) | TA | -65 | 150 | ℃ | Ta=25℃ | 3 | |
| 节点温度 (junction temperature) | TJ | 150 | ℃ | Ta=25℃ | 3 | ||
| HBM ESD 耐压 | 2000 | 3 | |||||
| MM ESD 耐压 | 200 | 3 | |||||
| 电源静态电流 (no load) | IDD | 4.4 | mA | VIN=0V，IO=0A，无负载 | 3 | ||
| 电源静态电流 (8Ω load) | IDD | 4.3 | mA | VIN=0V，IO=0A，负载 8Ω | 3 | ||
| 芯片掉电漏电流 (shutdown leakage) | IOFF | 4.2 | uA | 3 | |||
| 输出功率 8Ω (THD+N<1%) | PO | 1.1 | W | THD+N<1%，f=1KHZ | 3 | ||
| 输出功率 8Ω (THD+N<10%) | PO | 1.6 | W | THD+N<10%，f=1KHZ | 3 | ||
| 输出功率 4Ω (THD+N<1%) | PO | 1.6 | W | THD+N<1%，f=1KHZ | 3 | ||
| 输出功率 4Ω (THD+N<10%) | PO | 2.4 | W | THD+N<10%，f=1KHZ | 3 | ||
| 芯片唤醒时间 (wake-up time) | TD | 100 | ms | 3 | |||
| 电源电压抑制比 PSRR (typical at 217Hz) | PSRR | 63 | dB | Vripple=200mVPP，正弦波，输入接 10Ω电阻，f=217Hz | 3 | ||
| 电源电压抑制比 PSRR (typical at 1kHz) | PSRR | 68 | dB | Vripple=200mVPP，正弦波，输入接 10Ω电阻，f=1KHz | 3 | ||
| CBy 旁路电容 (recommended) | CBy | 1 | uF | 文中推荐值 | 2 |
CAD (KiCad official)
- Symbol:
FM8002E - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8-150mil (KiCad packages3D, STEP)
- 3D model files:
fm8002e-etched.step/fm8002e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fm8002e.step/fm8002e.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
fm8002e.step |
122 KB | You want the bare part, or you mark your own boards. |
fm8002e-etched.step |
1.8 MB | You want the part with FM8002E already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 434 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Fuman datasheet (6 pp, sha256
47f8d9bc8ff76c50, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).