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Contents

README

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SY8113CADC

Silergy Corp · DC-DC Converters · TSOT-23-6

SY8113CADC from Silergy Corp, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BS passive Boot-strap pin supplying the high side gate driver; decouple to the LX pin with a 0.1uF ceramic capacitor.
2 GND power_in Ground pin.
3 FB input Output feedback pin connected to the center point of the output resistor divider to program Vout=0.6*(1+R1/R2); reference is 0.6V.
4 EN input Enable control, pull high to turn on and do not float; rising threshold 1.5V typ, falling threshold 0.4V typ.
5 IN power_in Input supply pin for 4.5V to 18V operation; decouple to GND with at least 1uF ceramic capacitor.
6 LX output Inductor pin; connect to the switching node of the inductor.

Key specifications

Parameter Value
Manufacturer Silergy Corp
Package TSOT-23-6
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 4.5 18 V 3
Shutdown Current ISHDN 5 10 µA EN=0 3
Feedback Reference Voltage VREF 0.591 0.6 0.609 V 3
FB Input Current IFB -50 50 nA VFB=3.3V 3
Top FET RON RDS(ON)1 80 90 mΩ 3
Bottom FET RON RDS(ON)2 40 50 mΩ 3
Bottom FET Valley Current Limit ILIM 4 5.2 A 3
Min ON Time 40 60 90 ns 3
Min OFF Time 140 170 220 ns 3
Supply Input Voltage (abs max) VIN 19 V 2
FB Voltage (abs max) VFB 4 V 2
Power Dissipation PD 1 W TA = 25°C, TSOT23-6 (FC) 2
Junction Temperature TJ 150 °C 2
Lead Temperature 260 °C Soldering, 10 sec. 2
Storage Temperature Range TSTG -65 150 °C 2
Supply Input Voltage (recommended) VIN 4.5 18 V 2
Junction Temperature Range (recommended) TJ -40 125 °C 2
Ambient Temperature Range TA -40 85 °C 2
Thermal Resistance Junction-Ambient θJA 100 °C/W Note 2: natural convection, TA = 25°C, JEDEC 51-3 4-layer board 2
Thermal Resistance Junction-Case θJC 11.2 °C/W 2
Quiescent Current IQ 100 µA IOUT=0, VFB=VREF*105% 3
Top FET Peak Current Limit ILIM,TOP 6.6 A 3
EN Rising Threshold VENH 1.5 V 3
EN Falling Threshold VENL 0.4 V 3
Input UVLO Threshold VUVLO 4.5 V 3
UVLO Hysteresis VHYS 0.3 V 3
Switching Frequency 1 MHz 3
Soft-start Time tSS 800 us 3
Thermal Shutdown Temperature TSD 150 °C 3
Thermal Shutdown Hysteresis THYS 15 °C 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 3) The PCB copper area associated with LX pin must 8

CAD (KiCad official)

  • Symbol: SY8113CADC
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: sy8113cadc-etched.step / sy8113cadc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sy8113cadc.step / sy8113cadc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Silergy Corp datasheet (9 pp, sha256 975eeb9d7e7f6c1b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF