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Contents

README

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BL2301

GME(银河微电) · IC · SOT-23

BL2301 from GME(银河微电), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; the 3D package view on page 1 marks G on one of the two same-side leads, with a gate-source limit of ±12 V and a threshold of -0.4 to -1 V.
2 S passive Source; the 3D package view on page 1 marks S on the other same-side lead, and the body diode carries a forward drop of -1.2 V max at IS=-0.3 A.
3 D passive Drain; the single lead on the opposite side of the package, rated -20 V drain-source and -3 A continuous (-10 A pulsed).

Key specifications

Parameter Value
Manufacturer GME(银河微电)
Package SOT-23
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VDSS -20 V VGS=0V, ID=-250μA 2
Drain to Source Leakage Current IDSS -1 uA VDS=-20V, VGS=0V 2
Gate-body Leakage IGSS -100 100 nA VGS=±12V, VDS=0V 2
Static Drain-Source On-resistance RDS(ON) 63 110 mΩ VGS=-4.5V, ID=-2.8A 2
Static Drain-Source On-resistance RDS(ON) 90 140 mΩ VGS=-2.5V, ID=-2A 2
Gate Threshold Voltage VGS(TH) -0.4 -0.7 -1 V VDS= VGS, ID=-250uA 2
Diode Forward Voltage VSD -0.85 -1.2 V IS=-0.3A, VGS=0V 2
Drain-Source Voltage VDSS -20 V 1
Gate-Source Voltage VGSS -12 12 V 1
Continuous Drain Current ID -3 A TC=25℃ 1
Pulsed Drain Current IDM -10 A 1
Power Dissipation PD 1 W TC=25℃ 1
Thermal Resistance Junction to Ambient Air RθJA 145 ℃/W Junction to Ambient Air (NOTE1), surface mounted on FR4 board, t ≤ 10 sec 1
Operating Junction Temperature Range Tj 150 ℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Plated Leads, Solderable Per MIL-STD-202, Method 208. BL2301 1

CAD (KiCad official)

  • Symbol: BL2301
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bl2301-etched.step / bl2301-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bl2301.step / bl2301.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GME(银河微电) datasheet (4 pp, sha256 394fec7713ae1ce5, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF