component
US1GL
Public Made by Adomby adom
Changjing Fast Recovery / High Efficiency Diodes, SOD-123FL. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownUS1GL
Changjing · Fast Recovery / High Efficiency Diodes · SOD-123FL
US1GL from Changjing, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM | 400 | V | US1GL column (USM marking) | 1 | ||
| Maximum RMS Voltage | VRMS | 280 | V | US1GL column (USM marking) | 1 | ||
| Average Forward Current | IF(AV) | 1 | A | Resistive load, 60Hz half-sine wave, Ta=90℃, PCB 0.2"x0.2" copper pad | 1 | ||
| Surge (Non-repetitive) Forward Current | IFSM | 30 | A | 60Hz half-sine wave, 1 cycle, Ta=25℃ | 1 | ||
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | 150 | ℃ | 1 | ||
| Peak Forward Voltage | VF | 1.3 | V | IF=1.0A | 1 | ||
| Peak Reverse Current at Ta=25℃ | IRRM1 | 5 | μA | Ta=25℃, VR=VRRM | 1 | ||
| Peak Reverse Current at Ta=125℃ | IRRM2 | 50 | μA | Ta=125℃, VR=VRRM | 1 | ||
| Maximum reverse recovery time | trr | 50 | ns | IF=0.5A, IR=1.0A, Irr=0.25A | 1 | ||
| Thermal Resistance Junction to Ambient | RθJ-A | 50 | ℃/W | Between junction and ambient, PCB 0.2"x0.2" copper pad | 1 | ||
| Thermal Resistance Junction to Lead | RθJ-L | 25 | ℃/W | Between junction and terminal, PCB 0.2"x0.2" copper pad | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper | 1 |
CAD (KiCad official)
- Symbol:
US1GL - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
us1gl-etched.step/us1gl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);us1gl.step/us1gl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Changjing datasheet (4 pp, sha256
12a271a3118f6926, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).