component
HPJSD05CFN2
Public Made by Adomby adom
HXY MOSFET Electrostatic And Surge Protection (TVS/ESD), DFN1006-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHPJSD05CFN2
HXY MOSFET · Electrostatic And Surge Protection (TVS/ESD) · DFN1006-2L
HPJSD05CFN2 from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the bidirectional ESD protection diode, connected to the protected I/O line, with 5.0 V reverse working voltage and 5.8 V minimum breakdown at 1 mA. |
| 2 | 2 | passive | Second terminal of the bidirectional ESD protection diode, connected to the protected I/O line or ground, with 5.0 V reverse working voltage and ±30 kV contact/air ESD rating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | DFN1006-2L |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM | 5 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 5.8 | V | IT = 1mA | 2 | ||
| Reverse Leakage Current | IR | 1 | μA | VRWM = 5.0V | 2 | ||
| Clamping Voltage | VC | 9 | 9.8 | V | IPP = 1A, tp = 8/20μs | 2 | |
| Clamping Voltage | VC | 20 | V | IPP = 20A, tp = 8/20μs | 2 | ||
| Junction Capacitance | CJ | 40 | 50 | pF | VR = 0V, f = 1MHz | 2 | |
| Peak Pulse Power | PPP | 400 | W | tp = 8/20μs | 1 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10s | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 1 | ||
| Operating Temperature Range | Top | -55 | 150 | °C | 1 | ||
| Maximum junction temperature | Tj | 150 | °C | 1 | |||
| ESD air discharge | IEC61000-4-2 | -30 | 30 | kV | air discharge | 1 | |
| ESD contact discharge | IEC61000-4-2 | -30 | 30 | kV | contact discharge | 1 | |
| EFT | IEC61000-4-4 | 40 | A | 5/50 ns | 1 |
CAD (KiCad official)
- Symbol:
HPJSD05CFN2 - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files:
hpjsd05cfn2-etched.step/hpjsd05cfn2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hpjsd05cfn2.step/hpjsd05cfn2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
69f92fb7dc47f072, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).