TPS38900603NRTERQ1 from Texas Instruments, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	MON3	input	Voltage monitor channel 3 input, 0.2V to 5.5V monitored range (abs max 6V).
2	MON6	input	Voltage monitor channel 6 input, 0.2V to 5.5V monitored range (abs max 6V).
3	MON4	input	Voltage monitor channel 4 input, 0.2V to 5.5V monitored range (abs max 6V).
4	MON5	input	Voltage monitor channel 5 input, 0.2V to 5.5V monitored range (abs max 6V).
5	ACT	input	Active-high device enable driven by the host, 0V to 5.5V, with internal 100kΩ pull-down.
6	GND	power_in	Power ground.
7	SLEEP	input	Active-low sleep enable, 0V to 5.5V, with internal 100kΩ pull-down.
8	VDD	power_in	Supply rail, 2.5V to 5.5V recommended (abs max 6V); a 0.1µF to 1µF capacitor to GND is recommended if the supply is noisy.
9	SYNC	bidirectional	Sequence-logging synchronization between multiple devices, 0V to VDD, with internal 25kΩ to 100kΩ pull-up.
10	MON2	input	Voltage monitor channel 2 input, 0.2V to 5.5V monitored range (abs max 6V).
11	RS_1/2	input	Remote-sense input for monitor channels 1/2 (differential sensing), range -100mV to 100mV.
12	MON1	input	Voltage monitor channel 1 input, 0.2V to 5.5V monitored range (abs max 6V).
13	NIRQ	output	Active-low open-drain latched interrupt output, needs a 10kΩ to 100kΩ pull-up, 0V to 5.5V, up to 5mA sink.
14	ADDR	input	I2C address selection pin set by a resistor to ground (0x30 to 0x37), input voltage 0V to 1.8V.
15	SDA	bidirectional	I2C data line, open-drain, needs an external pull-up (10kΩ recommended), 0V to 5.5V.
16	SCL	input	I2C clock input, open-drain bus, needs an external pull-up (10kΩ recommended), 0V to 5.5V.
17	GND	power_in	Exposed power ground pad.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	WQFN-16(3x3)
Category	Power Management (PMIC)
Pins	17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage VDD	VDD	-0.3		6	V		8
NIRQ, NRST voltage		-0.3		6	V		8
ACT, SLEEP, SCL, SDA voltage		-0.3		6	V		8
SYNC voltage		-0.3			V	max = VDD+0.3	8
ADDR voltage		-0.3		2	V		8
MONx voltage		-0.3		6	V		8
NIRQ, NRST current		-10		10	mA		8
Operating junction temperature	TJ	-40		150	°C		8
Operating ambient temperature	TA	-40		125	°C	free-air	8
Storage temperature	Tstg	-65		150	°C		8
ESD HBM	V(ESD)	-2000		2000	V	ANSI/ESDA/JEDEC JS-001	8
ESD CDM all pins	V(ESD)	-500		500	V	AEC Q100-011, all pins	8
ESD CDM corner pins	V(ESD)	-750		750	V	AEC Q100-011, corner pins	8
Supply pin voltage	VDD	2.5		5.5	V		8
NIRQ, NRST pin voltage		0		5.5	V		8
NIRQ, NRST pin current	INIRQ, INRST	0		5	mA	±5 mA	8
ADDR pin voltage		0		1.8	V		8
MONx pin voltage		0		5.5	V		8
ACT, SLEEP, SCL, SDA pin voltage		0		5.5	V		8
SYNC pin voltage		0			V	max = VDD	8
Pull-up resistance (open-drain)	RUP	10		100	kΩ		8
Junction-to-ambient thermal resistance	RθJA		53.4		°C/W	RTE (WQFN)	9
Junction-to-case (top) thermal resistance	RθJC(top)		51.4		°C/W	RTE (WQFN)	9
Junction-to-board thermal resistance	RθJB		17.2		°C/W	RTE (WQFN)	9
Junction-to-top characterization parameter	ΨJT		0.3		°C/W	RTE (WQFN)	9
Junction-to-board characterization parameter	ΨJB		20.7		°C/W	RTE (WQFN)	9
Junction-to-case (bottom) thermal resistance	RθJC(bot)		3.9		°C/W	RTE (WQFN)	9
Input supply voltage	VDD	2.6		5.5	V		9
UVLO rising threshold	VDDUVLO	2.67		2.81	V	rising threshold	9
UVLO falling threshold	VDDUVLO	2.48		2.6	V	falling threshold	9
Power-on reset voltage	VPOR			1.65	V		9
Supply current, active	IDD_Active		1.55	2	mA	ACT = high, SLEEP = high, VDD <= 5.5V	9
Supply current, sleep	IDD_Sleep		1.55	2	mA	ACT = high, Sleep = low, I2C sleep power bit = 1, VDD <= 5.5V	9
Supply current, idle	IDD_Idle		200	280	µA	ACT = low, idle state, I2C and OVLF monitoring, VDD <= 5.5V, >10ms BIST	9
Supply current, deep sleep	IDD_Deep Sleep		275	380	µA	ACT = high, Sleep = low, I2C sleep power bit = 0, VDD <= 5.5V	9
MON voltage range	VMONX	0.2		5.5	V		9
MONx pin input current	IMONX			20	µA	VMON = 5V	9
MON LF range, 1x mode	VMON_LF	0.2		1.475	V	1x mode (no divider)	9
MON LF range, 4x mode	VMON_LF	0.8		5.5	V	4x divider	9
MON HF range, 1x mode	VMON_HF	0.2		1.475	V	1x mode (no divider)	9
MON HF range, 4x mode	VMON_HF	0.8		5.5	V	4x divider	9
Threshold granularity HF, 1x			5		mV	1x mode LSB	9
Threshold granularity HF, 4x			20		mV	4x mode LSB	9
LPF cutoff frequency LF		250		4000	Hz	I2C selectable, low-frequency channel	9
LPF cutoff frequency HF			4		MHz	high-frequency channel	10
HF accuracy 0.2-1.0V	Accuracy_HF	-6		6	mV	0.2V≤VMONX≤1.0V	10
HF accuracy 1.0-1.475V	Accuracy_HF	-7.5		7.5	mV	1.0V<VMONX≤1.475V	10
HF accuracy 1.475-2.95V	Accuracy_HF	-0.6		0.6	%	1.475V<VMONX≤2.95V	10
HF accuracy >2.95V	Accuracy_HF	-0.7		0.7	%	VMONX>2.95V	10
HF hysteresis 0.2-1.475V	VHYS_HF	5		11	mV	0.2V≤VMONX≤1.475V	10
HF hysteresis 1.475-2.95V	VHYS_HF	9		16	mV	1.475V<VMONX≤2.95V	10
HF hysteresis >2.95V	VHYS_HF	17		28	mV	VMONX>2.95V	10
MON off voltage threshold	MON_OFF	140		215	mV	monitored VMON falling	10
NIRQ output leakage	ILKG			300	nA	VDD=VNIRQ=5.5V	10
NIRQ low-level output voltage	VOL			100	mV	NIRQ, 5.5V/5mA	10
NRST low-level output voltage	VOL			100	mV	NRST, 5.5V/5mA	10
Thermal shutdown	TSD		155		°C		10
Remote sense range	RS	-100		100	mV		10
LF accuracy 1x mode	Accuracy_LF	-12		12	mV	1x mode (no divider)	11
LF accuracy 4x mode	Accuracy_LF	-40		40	mV	4x mode	11
Sequence timestamp accuracy	tSEQ_ACC	-5		5	%		11
HF fault propagation delay 1x NIRQ	tPD_NIRQ_1X		650		ns	default deglitch, VIT_OV/UV +/- 100mV	11

CAD (KiCad official)

Symbol: TPS38900603NRTERQ1
Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
3D model: WQFN-16(3x3) (KiCad packages3D, STEP)
3D model files: tps38900603nrterq1-etched.step / tps38900603nrterq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps38900603nrterq1.step / tps38900603nrterq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (141 pp, sha256 029ee8966653a11a, retrieved 2026-10-31, tier: manufacturer)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

TPS38900603NRTERQ1

Verified TPS38900603NRTERQ1

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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