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Contents

README

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SI2308

HXY MOSFET · MOSFETs · SOT-23

SI2308 from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal (labelled PIN1 G); gate-source voltage is rated at ±20 V absolute maximum.
2 D passive Drain terminal (labelled PIN2 D); the device is rated for 60 V drain-source voltage and 2.5 A continuous drain current.
3 S passive Source terminal (labelled PIN3 S); the datasheet gives no pin-specific limit for this terminal beyond the device ratings.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 1 2 V VDS=VGS, ID=250uA 2
Gate Leakage Current IGSS -100 100 nA VDS=0V, VGS=±12V 2
Zero Gate Voltage Drain Current IDSS 1 uA VDS=44V, VGS=0 2
Zero Gate Voltage Drain Current IDSS 5 uA VDS=44V, VGS=0, TJ=85℃ 2
On-State Drain Current ID(ON) 10 A VDS≧5V, VGS=4.5V 2
Drain-Source On-Resistance RDS(ON) 72 85 mΩ VGS=10V 2
Drain-Source On-Resistance RDS(ON) 103 mΩ VGS=4.5V 2
Forward Transconductance Gfs 10 S VDS=5V 2
Diode Forward Voltage VSD 0.8 V IS, VGS=0V 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 2.5 A 1
Drain Current-Pulsed IDM 10 A 1
Maximum Power Dissipation PD 1.25 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 62.5 ℃/W 1

CAD (KiCad official)

  • Symbol: SI2308
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2308-etched.step / si2308-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2308.step / si2308.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 43a28b1c960f12a3, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF