NCP160AMX330TBG from onsemi, in a XDFN-4(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	OUT	power_out	Regulated output voltage; the output should be bypassed with a small 1 µF ceramic capacitor, and the device is specified for 0 mA to 250 mA output current.
2	GND	power_in	Common ground connection.
3	EN	input	Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables it, with an absolute maximum rating of −0.3 V to 6 V.
4	IN	power_in	Input voltage supply pin; the operating input voltage range is 1.9 V to 5.5 V, with an absolute maximum of −0.3 V to 6 V.
5	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	XDFN-4(1x1)
Category	Others
Pins	5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Operating Input Voltage	VIN	1.9		5.5	V		4
Output Voltage Accuracy	VOUT	-2		2	%	VIN = VOUT(NOM) + 1 V; 0 mA ≤ IOUT ≤ 250 mA	4
Dropout Voltage, VOUT(NOM) = 3.3 V	VDO		80	145	mV	IOUT = 250 mA	4
Output Current Limit	ICL	250	700		mA	VOUT = 90% VOUT(NOM)	4
Quiescent Current	IQ		18	23	µA	IOUT = 0 mA	4
Shutdown Current	IDIS		0.01	1	µA	VEN ≤ 0.4 V, VIN = 4.8 V	4
EN Input Voltage High	VENH	1.2			V	EN Input Voltage “H”	4
EN Input Voltage Low	VENL			0.4	V	EN Input Voltage “L”	4
EN Pull Down Current	IEN		0.2	0.5	µA	VEN = 4.8 V	4
Line Transient, rising VIN step	TranLINE	-1			mV	VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs, IOUT = 1 mA	4
Line Transient, falling VIN step	TranLINE			1	mV	VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA	4
Load Transient, 1 mA to 200 mA step	TranLOAD	-40			mV	IOUT = 1 mA to 200 mA in 10 µs	4
Load Transient, 200 mA to 1 mA step	TranLOAD			40	mV	IOUT = 200 mA to 1 mA in 10 µs	4
Input Voltage (absolute maximum)	VIN	-0.3		6	V		3
Output Voltage (absolute maximum)	VOUT	-0.3		6	V	VOUT ≤ VIN + 0.3, max. 6 V	3
Chip Enable Input (absolute maximum)	VCE	-0.3		6	V		3
Maximum Junction Temperature	TJ			150	°C		3
Storage Temperature	TSTG	-55		150	°C		3
ESD Capability, Human Body Model	ESDHBM			2000	V	Tested per EIA/JESD22-A114	3
ESD Capability, Machine Model	ESDMM			200	V	Tested per EIA/JESD22-A115	3
Output Capacitor Effective Capacitance	COUT	0.7			µF	Accounts for temperature, DC bias and package size	14
Output Capacitor ESR	ESR			2	Ω	COUT ESR	14
Thermal Resistance, Junction-to-Air, XDFN4	RJA		198.1		°C/W	JEDEC board per JESD51-7 (Note 3)	3

CAD (KiCad official)

Symbol: NCP160AMX330TBG
Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
3D model: XDFN-4(1x1) (KiCad packages3D, STEP)
3D model files: ncp160amx330tbg-etched.step / ncp160amx330tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp160amx330tbg.step / ncp160amx330tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (23 pp, sha256 c3a4fa49f103f81f, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

NCP160AMX330TBG

Verified NCP160AMX330TBG

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README