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Contents

README

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BMD60N600C1

Bestirpower · MOSFETs · DPAK

BMD60N600C1 from Bestirpower, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drive with VGS up to ±30 V absolute maximum, with a threshold of 2 to 4 V at ID = 250 μA.
2 D passive Drain, connected to the exposed tab; drain-to-source voltage is 600 V minimum breakdown and continuous drain current is 8 A at TC = 25℃.
3 S passive Source; the body diode carries a continuous forward current of up to 8 A.

Key specifications

Parameter Value
Manufacturer Bestirpower
Package DPAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain to Source Voltage VDSS 600 V 1
Gate to Source Voltage VGSS -30 30 V 1
Drain Current, Continuous ID 8 A TC = 25℃ 1
Drain Current, Continuous ID 3.3 A TC = 125℃ 1
Drain Current, Pulsed IDM 24 A 1
Power Dissipation PD 62.5 W 1
Single Pulsed Avalanche Energy EAS 81 mJ VDD=50V, RG=25Ω, Starting Tj=25°C 1
MOSFET dv/dt ruggedness dv/dt 50 V/ns 1
Diode Recovery dv/dt ruggedness dv/dt 15 V/ns VDClink=400V; VDS,peak<V(BR)DSS 1
Storage Temperature Range TSTG -55 150 ℃ 1
Maximum Operating Junction Temperature TJ 150 ℃ 1
Maximum Lead Temperature for Soldering TL 260 ℃ 1/8" from case for 10 seconds 1
Thermal Resistance, Junction to Case, max RθJC 2 ℃/W TC = 25°C 1
Thermal Resistance, Junction to Ambient, max RθJA 62 ℃/W TC = 25°C 1
Drain to Source Breakdown Voltage BVDSS 600 V VGS= 0 V, ID = 250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS = 600 V, VGS = 0 V, Tj=25°C 2
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±20 V, VDS = 0 V 2
Gate Threshold Voltage VGS(th) 2 4 V VGS = VDS, ID = 250μA 2
Static Drain to Source On Resistance RDS(on) 600 mΩ VGS = 10 V, ID = 3.5A, Tj=25°C 2
Continuous Diode Forward Current ISD 8 A 2

CAD (KiCad official)

  • Symbol: BMD60N600C1
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: bmd60n600c1-etched.step / bmd60n600c1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bmd60n600c1.step / bmd60n600c1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Bestirpower datasheet (8 pp, sha256 9138882cf51109b8, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF