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BD62110AEFJ-E2
Public Made by Adomby adom
ROHM Semicon Brushed DC Motor Drivers, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBD62110AEFJ-E2
ROHM Semicon · Brushed DC Motor Drivers · SOP-8-EP
BD62110AEFJ-E2 from ROHM Semicon, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal; keep its wiring impedance as low as possible to reduce switching noise and stabilize the internal reference voltage. |
| 2 | OUT1 | output | H bridge output terminal that carries the motor drive current, so the trace should be thick, short and low impedance, with a Schottky diode optional for large back-EMF; absolute maximum output current is 1.0 A/ch continuous and 2.0 A peak. |
| 3 | VCC | power_in | Power supply terminal with a recommended operating range of 8 to 28 V and an absolute maximum of -0.2 to +36.0 V, bypassed with a 100µF to 470µF capacitor placed as close as possible to the pin. |
| 4 | GND | power_in | Ground terminal; keep its wiring impedance as low as possible to reduce switching noise and stabilize the internal reference voltage. |
| 5 | IN1 | input | H bridge control input that sets the output state together with IN2 (absolute maximum -0.2 to +5.5 V, H level at least 2.0 V, L level at most 0.8 V). |
| 6 | IN2 | input | H bridge control input that sets the output state together with IN1 (absolute maximum -0.2 to +5.5 V, H level at least 2.0 V, L level at most 0.8 V). |
| 7 | TEST | passive | Test terminal used only for distribution testing that must be connected to GND, since the device may malfunction if it is left unconnected. |
| 8 | OUT2 | output | H bridge output terminal that carries the motor drive current, so the trace should be thick, short and low impedance, with a Schottky diode optional for large back-EMF; absolute maximum output current is 1.0 A/ch continuous and 2.0 A peak. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOP-8-EP |
| Category | Motor Driver ICs |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Circuit Current at Standby | ICCST | 10 | µA | IN1=L, IN2=L | 3 | ||
| Circuit Current | ICC | 1.4 | 2.5 | mA | IN1=H or IN2=H | 3 | |
| H Level Input Voltage | VINH | 2 | V | 3 | |||
| L Level Input Voltage | VINL | 0.8 | V | 3 | |||
| H Level Input Current | IINH | 35 | 50 | 100 | µA | VIN=5V | 3 |
| L Level Input Current | IINL | -10 | 0 | µA | VIN=0V | 3 | |
| Output ON-Resistance (sum of upper and lower) | RON | 1.8 | 2.3 | Ω | IOUT =±0.7A (Sum of upper and lower) | 3 | |
| Output Leak Current | ILEAK | 10 | µA | 3 | |||
| Supply Voltage (absolute maximum) | VCC | -0.2 | 36 | V | 3 | ||
| Power Dissipation | Pd | 0.82 | W | Note 1: mounted on 70mm×70mm×1.6mm glass epoxy board; reduced by 4.7mW/°C above Ta=25°C | 3 | ||
| Power Dissipation | Pd | 3.75 | W | Note 2: mounted using 4-layers; reduced by 30mW/°C above Ta=25°C | 3 | ||
| Input Voltage for Control Pin | VIN | -0.2 | 5.5 | V | 3 | ||
| Output Current | IOUT | 1 | A/ch | Note 3: do not exceed Pd and Tjmax=150°C | 3 | ||
| Output Current (peak) | IOUTPEAK | 2 | A/ch | Note 4: Pulse width tw ≤1ms, duty 20ms | 3 | ||
| Operating Temperature Range | Topr | -25 | 85 | °C | 3 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 3 | ||
| Maximum Junction Temperature | Tjmax | 150 | °C | Stated in Notes 3 and 5 (do not exceed Pd and Tjmax=150°C) | 3 | ||
| Supply Voltage (recommended) | VCC | 8 | 28 | V | Ta= -25 to +85°C | 3 | |
| Maximum Output Current (Continuous) | IOUT | 0.7 | A/ch | Ta= -25 to +85°C; Note 5: do not exceed Pd and Tjmax=150°C | 3 | ||
| Thermal resistance θja, Board 1 (1-layer, copper foil 0mm x 0mm) | θja | 153.2 | °C/W | ROHM board 70mm x 70mm x 1.6mm with through holes; Board ① | 12 | ||
| Thermal resistance θja, Board 2 (2-layer, copper foil 15mm x 15mm) | θja | 113.6 | °C/W | ROHM board 70mm x 70mm x 1.6mm with through holes; Board ② | 12 | ||
| Thermal resistance θja, Board 3 (2-layer, copper foil 70mm x 70mm) | θja | 59.2 | °C/W | ROHM board 70mm x 70mm x 1.6mm with through holes; Board ③ | 12 | ||
| Thermal resistance θja, Board 4 (4-layer, copper foil 70mm x 70mm) | θja | 33.3 | °C/W | ROHM board 70mm x 70mm x 1.6mm with through holes; Board ④ | 12 |
CAD (KiCad official)
- Symbol:
BD62110AEFJ-E2 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
bd62110aefj-e2-etched.step/bd62110aefj-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd62110aefj-e2.step/bd62110aefj-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (19 pp, sha256
244f4483ab0a5a3a, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).