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RS2G07XC6

Public Made by Adom

by adom

Jiangsu RUNIC Tech Inverters, SC70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Datasheet

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Contents

README

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RS2G07XC6

Jiangsu RUNIC Tech · Inverters · SC70-6

RS2G07XC6 from Jiangsu RUNIC Tech, in a SC70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Input 1 of the dual buffer; inputs accept voltages up to 5.5 V.
2 GND power_in Ground reference pin for the device.
3 2A input Input 2 of the dual buffer; inputs accept voltages up to 5.5 V.
4 2Y output Open-drain output 2; outputs accept voltages up to 5.5 V, and Ioff circuitry disables the output to prevent backflow when the device is powered down.
5 VCC power_in Supply pin; operating range is 1.65 V to 5.5 V.
6 1Y output Open-drain output 1; outputs accept voltages up to 5.5 V, and Ioff circuitry disables the output to prevent backflow when the device is powered down.

Key specifications

Parameter Value
Manufacturer Jiangsu RUNIC Tech
Package SC70-6
Category Logic
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, operating VCC 1.65 5.5 V Operating 7
Supply voltage, data retention only VCC 1.5 V Data retention only 7
Input voltage VI 0 5.5 V 7
Output voltage VO 0 5.5 V 7
Operating temperature TA -40 125 °C 7
High-level input voltage VIH 1.7 V VCC=2.3V to 2.7V 7
High-level input voltage VIH 2.2 V VCC=3V to 3.6V 7
Low-level input voltage VIL 0.3 V VCC=2.3V to 2.7V 7
Low-level input voltage VIL 0.4 V VCC=3V to 3.6V 7
Input transition rise or fall rate Δt/Δv 20 ns/V VCC=1.8V±0.15V, 2.5V±0.2V 7
Input transition rise or fall rate Δt/Δv 10 ns/V VCC=3.3V±0.3V 7
Input transition rise or fall rate Δt/Δv 5 ns/V VCC=5V±0.5V 7
Low-level output voltage VOL 0.1 V IOL=100µA, VCC=1.65V to 5.5V, TEMP Full 8
Low-level output voltage VOL 0.45 V IOL=4mA, VCC=1.65V 8
Low-level output voltage VOL 0.3 V IOL=8mA, VCC=2.3V 8
Low-level output voltage VOL 0.4 V IOL=16mA, VCC=3V 8
Low-level output voltage VOL 0.55 V IOL=24mA, VCC=3V 8
Input leakage current, +25°C II -1 0.1 1 µA A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, TEMP +25C 8
Input leakage current, full temperature range II -5 5 µA A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, TEMP Full 8
Power-off leakage current, +25°C Ioff -1 0.1 1 µA VI or VO=5.5V, VCC=0, TEMP +25C 8
Power-off leakage current, full temperature range Ioff -10 10 µA VI or VO=5.5V, VCC=0, TEMP Full 8
Quiescent supply current, +25°C ICC 0.1 1 µA VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, TEMP +25C 8
Quiescent supply current, full temperature range ICC 10 µA VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, TEMP Full 8
Additional quiescent supply current per input ΔICC 500 µA One input at VCC-0.6V, other inputs at VCC or GND, VCC 3V to 5.5V, TEMP Full 8
Propagation delay tpd 6.4 ns VCC=1.8V±0.15V, CL=30pF, RL=1kΩ, TEMP Full 8
Propagation delay tpd 4.5 ns VCC=2.5V±0.2V, CL=30pF, RL=500Ω, TEMP Full 8
Propagation delay tpd 4.2 ns VCC=3.3V±0.3V, CL=50pF, RL=500Ω, TEMP Full 8
Propagation delay tpd 3.7 ns VCC=5V±0.5V, CL=50pF, RL=500Ω, TEMP Full 8
Input capacitance Ci 4 pF VCC=3.3V, VI=VCC or GND, TEMP +25C 8
Power dissipation capacitance Cpd 3 pF VCC=1.8V, f=10MHz, TEMP +25C 8
Power dissipation capacitance Cpd 4 pF VCC=3.3V, f=10MHz, TEMP +25C 8
Power dissipation capacitance Cpd 6 pF VCC=5V, f=10MHz, TEMP +25C 8
Supply voltage VCC -0.5 6.5 V 6
Input voltage range VI -0.5 6.5 V 6
Output voltage range Vo -0.5 6.5 V 6
Input clamp current IIK -50 mA VI<0 6
Output clamp current IOK -50 mA VO<0 6
Continuous output current IO -50 50 mA 6
Continuous current through VCC or GND -100 100 mA 6
Junction temperature TJ -65 150 °C 6
Storage temperature Tstg -65 150 °C 6
Junction-to-ambient thermal resistance (SOT363(SC70-6)) RθJA 214.7 °C/W 6
Junction-to-case (top) thermal resistance (SOT363(SC70-6)) RθJC(top) 127.1 °C/W 6
Junction-to-board thermal resistance (SOT363(SC70-6)) RθJB 60 °C/W 6

CAD (KiCad official)

  • Symbol: RS2G07XC6
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SC70-6 (KiCad packages3D, STEP)
  • 3D model files: rs2g07xc6-etched.step / rs2g07xc6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs2g07xc6.step / rs2g07xc6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu RUNIC Tech datasheet (13 pp, sha256 77de2c55f6e6d7a6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF