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Contents

README

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1SMA5930BT3G

onsemi · Zener Diodes · SMA

1SMA5930BT3G from onsemi, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode of the 16 V (15.2 V to 16.8 V at IZT = 23.4 mA) Zener diode, marked by the polarity band, which is taken positive in reverse-Zener regulation.
2 ANODE passive Anode of the Zener diode, which is the negative terminal in reverse-Zener regulation with a forward voltage of 1.2 V max at IF = 200 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 15.2 16 16.8 V @ IZT = 23.4 mA, TA = 25°C 2
Zener Voltage Tolerance VZ -5 5 % Type number indicates tolerance of ±5% 2
Maximum Zener Impedance @ IZT ZZT 10 Ω @ IZT 2
Maximum Zener Impedance @ IZK ZZK 600 Ω @ IZK = 0.25 mA 2
Reverse Leakage Current IR 0.5 µA @ VR = 12.2 V 2
Maximum DC Zener Current IZM 94 mA 2
Forward Voltage VF 1.2 V @ IF = 200 mA, all types 2
DC Power Dissipation @ TL = 75°C PD 1.5 W Measured Zero Lead Length, 1 in square copper pad, FR-4 board 1
Derate above 75°C 20 mW/°C TL > 75°C 1
DC Power Dissipation @ TA = 25°C PD 0.5 W FR-4 Board, ON Semiconductor minimum recommended footprint 1
Derate above 25°C 4 mW/°C TA > 25°C 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Thermal Resistance, Junction-to-Lead RθJL 50 °C/W 1 in square copper pad, FR-4 board 1
Thermal Resistance, Junction-to-Ambient RθJA 250 °C/W FR-4 Board, minimum recommended footprint 1
Maximum Case Temperature for Soldering 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: 1SMA5930BT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: 1sma5930bt3g-etched.step / 1sma5930bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1sma5930bt3g.step / 1sma5930bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 718bfbda0fd2b50b, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF