ADM3063EARZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NIC	unconnected	No Internal Connection; this pin is not internally connected.
2	RO	output	Receiver Output Data is high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, and is tristated when RE is driven high.
3	RE	input	Receiver Enable Input is active low: driving it low enables the receiver and driving it high disables the receiver.
4	DE	input	Driver Enable: a high level enables the driver differential outputs Y and Z, and a low level places the driver output into a high impedance state.
5	DI	input	Transmit Data Input: data to be transmitted by the driver is applied to this input.
6	GND	power_in	Ground.
7	GND	power_in	Ground.
8	NIC	unconnected	No Internal Connection; this pin is not internally connected.
9	Y	output	Driver Noninverting Output is put into a high impedance state when the driver is disabled or VCC is powered down, to avoid overloading the bus.
10	Z	output	Driver Inverting Output is put into a high impedance state when the driver is disabled or VCC is powered down, to avoid overloading the bus.
11	B	input	Inverting Receiver Input.
12	A	input	Noninverting Receiver Input.
13	VCC	power_in	3.0 V to 5.5 V power supply; adding a 0.1 µF decoupling capacitor between the VCC and GND pins is recommended.
14	VCC	power_in	3.0 V to 5.5 V power supply; adding a 0.1 µF decoupling capacitor between the VCC and GND pins is recommended.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-14
Category	Communication Interface Chip/UART/485/232
Pins	14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
No Load Supply Current (DE = VIO, RE = 0 V)	ICC		3.5	7.5	mA	DE = VIO, RE = 0 V	4
No Load Supply Current (DE = VIO, RE = VIO)	ICC		3.5	7.5	mA	DE = VIO, RE = VIO	4
No Load Supply Current (DE = 0 V, RE = 0 V)	ICC		3	4.5	mA	DE = 0 V, RE = 0 V	4
Supply Current, Data Rate = 500 kbps	ICC		100	165	mA	RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V)	4
Supply Current, Data Rate = 500 kbps	ICC		56	74	mA	RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V)	4
Supply Current in Shutdown Mode	ISHDN		210	450	µA	DE = 0 V, RE = VIO	4
Output Voltage, Loaded	/VOD2/	2	2.5		V	VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38	4
Output Voltage, Loaded (RS-485)	/VOD2/	1.5	2.1		V	VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38	4
Output Voltage, Loaded	/VOD2/	2.1	3.5		V	VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38	4
Output Voltage, Loaded (RS-485)	/VOD2/	2.1	3		V	VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38	4
Output Voltage over Common-Mode Range	/VOD3/	1.5	2.1		V	VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39	4
Output Voltage over Common-Mode Range	/VOD3/	2.1	3		V	VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39	4
Common-Mode Output Voltage	VOC		1.6	3	V	RL = 27 Ω or 50 Ω, see Figure 38	4
Output Short-Circuit Current	IOS	-250		250	mA	−7 V < VOUT < +12 V	4
Output Leakage (Y, Z)	IO			100	µA	DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V	4
Output Leakage (Y, Z)	IO	-100			µA	DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V	4
Logic Input Current	II	-2		2	µA	DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO	4
Differential Input Threshold Voltage	VTH	-200	-125	-30	mV	−7 V < VCM < +12 V	4
Input Current (A, B)	II		0.1	0.25	mA	DE = 0 V, VCC = powered/unpowered, VIN = 12 V	4
Input Current (A, B)	II		-0.2	-0.1	mA	DE = 0 V, VCC = powered/unpowered, VIN = −7 V	4
Line Input Resistance	RIN		48	96	kΩ	−7 V ≤ VCM ≤ +12 V	4
Supply Voltage (VCC)	VCC	3		5.5	V		4
Operating Temperature Range (A grade)		-40		85	°C	A grade	8
VCC to GND	VCC			6	V		8
Digital Input and Output Voltage (DE, RE, DI, and RO)		-0.3			V	DE, RE, DI, and RO	8
Driver Output and Receiver Input Voltage		-9		14	V		8
Storage Temperature Range		-65		150	°C		8
Maximum Junction Temperature	TJ			150	°C		8
Lead Temperature Soldering				300	°C	10 sec	8
Lead Temperature Vapor Phase				215	°C	60 sec	8
Lead Temperature Infrared				220	°C	15 sec	8
Continuous Total Power Dissipation				0.239	W	14-Lead SOIC_N	8
ESD on Bus Pins, IEC 61000-4-2 Contact Discharge		-12		12	kV	Bus pins (A, B, Y, Z), IEC 61000-4-2 contact discharge	8
ESD Human Body Model, All Other Pins		-8		8	kV	All other pins, HBM	8
Thermal Resistance Junction to Ambient (R-14)	θJA		104.5		°C/W	JEDEC 2S2P thermal test board, no bias	8
Thermal Resistance Junction to Case (R-14)	θJC		42.9		°C/W	JEDEC 2S2P thermal test board, no bias	8

CAD (KiCad official)

Symbol: ADM3063EARZ
Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
3D model: SOIC-14 (KiCad packages3D, STEP)
3D model files: adm3063earz-etched.step / adm3063earz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3063earz.step / adm3063earz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ADM3063EARZ

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3D Model

Symbol & Footprint

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