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Contents

README

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GC4D30120H

SUPSiC · SiC Diodes · TO-247-2

GC4D30120H from SUPSiC, in a TO-247-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PIN 1 passive Labelled PIN 1 on the TO-247-2 package drawing; the datasheet does not state whether this terminal is the anode or the cathode.
2 PIN 2 passive Labelled PIN 2 on the TO-247-2 package drawing; the datasheet does not state whether this terminal is the anode or the cathode.

Key specifications

Parameter Value
Manufacturer SUPSiC
Package TO-247-2
Category Silicon Carbide (SiC) Devices
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage (TJ = 25 °C) VF 1.5 1.8 V IF = 30 A, TJ = 25 °C 2
Forward Voltage (TJ = 175 °C) VF 2.2 3 V IF = 30 A, TJ = 175 °C 2
Reverse Current (TJ = 25 °C) IR 40 250 µA VR = 1200 V, TJ = 25 °C 2
Reverse Current (TJ = 175 °C) IR 70 450 µA VR = 1200 V, TJ = 175 °C 2
Repetitive Peak Reverse Voltage VRRM 1200 V 1
DC Blocking Voltage VDC 1200 V 1
Continuous Forward Current (TJ = 25 °C) IF 94 A TJ = 25 °C 1
Continuous Forward Current (TJ = 135 °C) IF 45 A TJ = 135 °C 1
Continuous Forward Current (TJ = 155 °C) IF 30 A TJ = 155 °C 1
Repetitive Peak Forward Surge Current (Tc = 25 °C) IFRM 121 A Tc = 25 °C, tp = 10 ms, Half Sine Pulse 1
Repetitive Peak Forward Surge Current (Tc = 110 °C) IFRM 68 A Tc = 110 °C, tp = 10 ms, Half Sine Pulse 1
Non-Repetitive Forward Surge Current (Tc = 25 °C) IFSM 233 A Tc = 25 °C, tp = 10 ms, Half Sine Pulse 1
Non-Repetitive Forward Surge Current (Tc = 110 °C) IFSM 209 A Tc = 110 °C, tp = 10 ms, Half Sine Pulse 1
Power Dissipation (Tc = 25 °C) Ptot 441 W Tc = 25 °C 1
Power Dissipation (Tc = 110 °C) Ptot 191 W Tc = 110 °C 1
i2t Value (Tc = 25 °C) ∫i2t 271 A2s Tc = 25 °C, tp = 10 ms 1
i2t Value (Tc = 110 °C) ∫i2t 218 A2s Tc = 110 °C, tp = 10 ms 1
Operating Junction & Storage Temperature TJ, Tstg -55 175 °C 2
Maximum Processing Temperature TPROC 325 10 min. Maximum 2
Thermal Resistance, Junction to Case Rθ, JC 0.34 °C / W 2

CAD (KiCad official)

  • Symbol: GC4D30120H
  • Footprint: Package_TO_SOT_THT:TO-247-2_Vertical
  • 3D model: TO-247-2 (KiCad packages3D, STEP)
  • 3D model files: gc4d30120h-etched.step / gc4d30120h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gc4d30120h.step / gc4d30120h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SUPSiC datasheet (5 pp, sha256 7b9914f5680267c5, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF