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Contents

README

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DSL70E6327

Infineon Technologies · ESD And Surge Protection (TVS/ESD) · SOT-143

DSL70E6327 from Infineon Technologies, in a SOT-143. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference of the rail-to-rail TVS array, to be connected directly to a ground plane on the board.
2 I/O1 passive Protected signal line 1 (rail-to-rail steering diodes D1/D2), 2.5 pF typ. to GND, reverse working voltage 50 V max, ESD ±15 kV contact.
3 I/O2 passive Protected signal line 2 (rail-to-rail steering diodes D3/D4), 2.5 pF typ. to GND, reverse working voltage 50 V max, ESD ±15 kV contact.
4 VCC power_in Positive rail connection of the rail-to-rail TVS array (Vcc in application example), with reverse working voltage 50 V max.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-143
Category Circuit Protection
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ESD contact discharge per diode VESD 15 kV according to IEC61000-4-2 1
Peak pulse current Ipp 27 A tp = 8/20 µs, according to IEC61000-4-5 1
Peak pulse power Ppk 245 W tp = 8/20 µs 1
Reverse working voltage VRWM 50 V 2
Reverse current IR 5 nA VR = 50 V 2
Forward clamping voltage VFC 1 1.5 V IPP = 1 A, tP = 8/20 µs 2
Forward clamping voltage VFC 2.5 3 V IPP = 10 A, tP = 8/20 µs 2
Forward clamping voltage VFC 5 6 V IPP = 24 A, tP = 8/20 µs 2
Forward clamping voltage VFC 6 9 V IPP = 27 A, tP = 8/20 µs 2
Diode capacitance (I/O to GND) CT 2.5 5 pF VR = 0 V, f = 1 MHz, between I/O and GND 2
Diode capacitance (between I/O pins) CT 1.25 2.5 pF VR = 0 V, f = 1 MHz, between I/O pins 2

CAD (KiCad official)

  • Symbol: DSL70E6327
  • Footprint: Package_TO_SOT_SMD:SOT-143
  • 3D model: SOT-143 (KiCad packages3D, STEP)
  • 3D model files: dsl70e6327-etched.step / dsl70e6327-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dsl70e6327.step / dsl70e6327.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (6 pp, sha256 c6e5540798f66f06, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF