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Contents

README

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MPQ5850GJ-AEC1-Z

MONOLITHIC POWER SYSTEMS INC. · Global Sourcing Parts · TSOT-23-8

MPQ5850GJ-AEC1-Z from MONOLITHIC POWER SYSTEMS INC., in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN/UVLO input Enable pin that shuts the chip down when pulled below 1V and enables it when pulled above 1.2V, and it must not be left floating.
2 PG output Open-drain power good pin that asserts low when the device is disabled, the reservoir supply is out of regulation, or the fast pull-up path is active for longer than 17μs.
3 GND power_in Ground connection of the device, which must be connected to the board ground plane.
4 SW passive Switch node of the internal boost regulator, with an inductor connected between SW and DRAIN.
5 RES power_in Reservoir supply for the external N-channel MOSFET gate driver, requiring a minimum 1μF ceramic capacitor between RES and DRAIN.
6 DRAIN power_in Drain connection to the external power MOSFET that also supplies the internal circuitry, requiring a minimum 4.7μF capacitor from DRAIN to ground.
7 GATE output Gate connection to the external power MOSFET gate, with 170mA fast pull-up and 430mA fast pull-down current.
8 SOURCE input Source connection to the external power MOSFET source, sensed together with DRAIN to control the gate, with an absolute maximum range of -36V to +42V.

Key specifications

Parameter Value
Manufacturer MONOLITHIC POWER SYSTEMS INC.
Package TSOT-23-8
Category Global Sourcing Parts
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain voltage at start-up VDRAIN_UVLO 2.8 3.2 V 5
Drain voltage UVLO falling VDRAIN_UVLO_F 2.4 2.6 2.8 V 5
Reservoir UVLO rising VRES_UVLO 8 11 13 V 5
Reservoir UVLO hysteresis VRES_UVLO_HYS 0.2 V 5
Quiescent current in standby ISHDN 4 10 μA VEN = 0V, TJ = 25°C 5
Quiescent current in standby ISHDN 20 μA VEN = 0V, TJ = -40°C to +150°C 5
Quiescent current in steady state IQ 30 50 μA VEN = 2V, in regulation, system input current, TJ = 25°C 5
Quiescent current in steady state IQ 100 μA VEN = 2V, in regulation, system input current, TJ = -40°C to +125°C 5
Quiescent current in steady state IQ 200 μA VEN = 2V, in regulation, system input current, TJ = 125°C to 150°C 5
Source to drain regulation voltage VSD 10 20 30 mV 5
Source to drain fast pull-up threshold VSD_FPU 50 75 100 mV 5
Source to drain fast pull-down threshold VSD_FPD -15 -4 0 mV 5
Drain current ID 50 μA Gate driver in regulation 5
Source current IS_R -1 mA VSOURCE = -36V 5
Fast pull up current IFPU 170 mA VGATE-RES = -7V 5
Fast pull down current IFPD 430 mA VGATE-SOURCE = 5V 5
Reverse biased gate-source voltage VGS_RB 0.01 0.3 V VSOURCE = -5V, IGATE = 1mA 5
Gate turn-on delay time tON 1.2 2 μs Step (VSOURCE - VDRAIN) from -100mV to +3V, VRES-DRAIN = 13V, CGATE-SOURCE = 10nF 5
Gate turn-off delay time tOFF 1 2 μs Step (VSOURCE - VDRAIN) from 3V to -100mV, VRES-DRAIN = 13V, CGATE-SOURCE = 10nF 5
Gate rising time tRISING 300 ns Step (VSOURCE - VDRAIN) from -100mV to +3V, VRES-DRAIN = 13V, CGATE-SOURCE = 10nF 5
Gate falling time tFALLING 100 ns Step (VSOURCE - VDRAIN) from 3V to -100mV, VRES-DRAIN = 13V, CGATE-SOURCE = 10nF 5
Maximum rectification frequency fMAX 50 kHz VPP = 6V, CGATE-SOURCE = 15nF 5
Maximum rectification frequency fMAX 100 kHz VPP = 2V, CGATE-SOURCE = 15nF 5
Reservoir regulation voltage VREG 10 12 14 V 6
Reservoir regulation UVLO hysteresis VREG_UVLO_HYS 1.2 V VREG - VRES_UVLO - VRES_UVLO_HYS 6
Boost current limit IBOOST 160 220 280 mA 6
SW leakage ISW 1 μA 6
Boost power switch on resistance RSW 1.5 3.5 Ω 6
Boost rectifier diode voltage drop VDIODE 0.9 V IDIODE = 220mA 6
Enable threshold rising VEN 1 1.2 1.4 V 6
Enable threshold falling VEN_F 0.8 1 1.2 V 6
Enable hysteresis VEN_H 200 mV 6
Enable leakage IEN 1 μA VEN = 3V 6
PG output voltage low VPG_LOW 0.1 0.3 V ISINK = 1mA 6
Thermal shutdown TSD 175 °C Derived from bench characterization, not tested in production 6
Thermal shutdown hysteresis TSD_HYS 25 °C Derived from bench characterization, not tested in production 6
SOURCE, EN/UVLO voltage VSOURCE, VEN/UVLO -36 42 V 4
DRAIN voltage VDRAIN -0.3 42 V 4
DRAIN - SOURCE voltage VDRAIN-SOURCE -2 52 V 4
GATE - SOURCE voltage VGATE-SOURCE -0.3 13 V 4
RES voltage VRES -0.3 V Upper limit is VDRAIN + 13V 4
SW voltage VSW -0.3 57 V 4
PG voltage VPG -0.3 6 V 4
Junction temperature TJ 150 °C 4
Supply voltage VIN 3.3 36 V 4
Operating junction temperature TJ -40 150 °C 4
Thermal resistance junction-to-ambient θJA 85 °C/W JESD51-7, 4-layer PCB 4
Thermal resistance junction-to-case θJC 20 °C/W JESD51-7, 4-layer PCB 4

CAD (KiCad official)

  • Symbol: MPQ5850GJ-AEC1-Z
  • Footprint: Package_TO_SOT_SMD:TSOT-23-8
  • 3D model: TSOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: mpq5850gj-aec1-z-etched.step / mpq5850gj-aec1-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpq5850gj-aec1-z.step / mpq5850gj-aec1-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MONOLITHIC POWER SYSTEMS INC. datasheet (29 pp, sha256 99caec3edd256fd8, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF