component
UCC27735QDRQ1
Public Made by Adomby adom
Texas Instruments , SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUCC27735QDRQ1
Texas Instruments · IC · SOIC-14
UCC27735QDRQ1 from Texas Instruments, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | HI | input | Logic input for high-side driver; if HI is unbiased or floating, HO is held low. |
| 2 | LI | input | Logic input for low-side driver; if LI is unbiased or floating, LO is held low. |
| 3 | VSS | power_in | Logic ground. |
| 4 | EN/NC | input | Enable input for both drivers; biased low disables HO and LO regardless of HI and LI, biased high or floating enables both. |
| 5 | COM | power_in | Return for the low-side driver output; on UCC27735 it is separate from VSS (VSS-COM rated -7V to 6V). |
| 6 | LO | output | Low-side driver output. |
| 7 | VDD | power_in | Bias supply input (10V to 21V VDD-VSS) for the input logic and low-side driver output, bypassed to VSS with a typical 1µF capacitor, and to COM with 100nF if a shunt resistor is used between COM and VSS. |
| 8 | NC | unconnected | No connection. |
| 9 | NC | unconnected | No connection. |
| 10 | NC | unconnected | No connection. |
| 11 | HS | passive | Return for the high-side floating supply (switch node), rated up to 700V absolute maximum. |
| 12 | HO | output | High-side driver output. |
| 13 | HB | power_in | High-side floating supply (up to 700V absolute maximum), bypassed to HS with a capacitor typically 10× the gate capacitance for bootstrap operation. |
| 14 | NC | unconnected | No connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14 |
| Category | |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| HI, LI, EN input voltage | -6 | 23 | V | with respect to VSS | 5 | ||
| VDD supply voltage | VDD | -0.3 | 23 | V | 5 | ||
| VDD-VSS | VDD-VSS | -0.3 | 23 | V | 5 | ||
| HB voltage | HB | -0.3 | 700 | V | 5 | ||
| HB-HS | HB-HS | -0.3 | 23 | V | 5 | ||
| HS-VSS DC | HS-VSS | -18 | 700 | V | DC, at HB-HS = 15 V | 5 | |
| HS-VSS transient | HS-VSS | -23 | 700 | V | Transient, less than 100 ns, at HB-HS = 15 V | 5 | |
| VSS-COM | VSS-COM | -7 | 6 | V | UCC27735 only | 5 | |
| Offset supply voltage transient | dVHS/dt | -200 | 200 | V/ns | Allowable offset supply voltage transient | 5 | |
| Junction temperature | TJ | -40 | 150 | °C | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human body model, ANSI/ESDA/JEDEC JS-001; HB, HO, HS rated 1000 V | 5 | |
| ESD CDM | V(ESD) | -500 | 500 | V | Charged device model, JESD22-C101 | 5 | |
| VDD-COM supply voltage | VDD-COM | 6 | 21 | V | UCC27735 only | 5 | |
| VDD-VSS supply voltage | VDD-VSS | 10 | 21 | V | 5 | ||
| Driver bootstrap voltage | HB-HS | 10 | 21 | V | 5 | ||
| HS-VSS source terminal voltage DC | HS-VSS | 600 | V | DC | 5 | ||
| HS-VSS source terminal voltage transient | HS-VSS | 650 | V | Transient, less than 100 ns | 5 | ||
| HB-VSS HB pin voltage | HB-VSS | 3 | V | HB below 3V does NOT allow the output to change state | 6 | ||
| HI, LI, EN input voltage | -5 | 21 | V | with respect to VSS | 6 | ||
| VSS input logic ground | VSS | -5 | 5 | V | UCC27735 only | 6 | |
| Ambient temperature | TA | -40 | 125 | °C | 6 | ||
| Junction temperature | TJ | -40 | 150 | °C | 6 | ||
| Junction-to-ambient thermal resistance | RθJA | 80.6 | °C/W | 14 pins SOIC | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 41.4 | °C/W | 14 pins SOIC | 6 | ||
| Junction-to-board thermal resistance | RθJB | 40.1 | °C/W | 14 pins SOIC | 6 | ||
| Junction-to-top characterization parameter | ψJT | 6.9 | °C/W | 14 pins SOIC | 6 | ||
| Junction-to-board characterization parameter | ψJB | 39.7 | °C/W | 14 pins SOIC | 6 | ||
| VDD turn-on threshold | VVDD ON | 8.3 | 9 | 9.7 | V | 8V UVLO | 6 |
| VDD turn-off threshold | VVDD OFF | 7.8 | 8.5 | 9.2 | V | 8V UVLO | 6 |
| VDD UVLO hysteresis | VVDD HYS | 0.6 | V | 8V UVLO | 6 | ||
| VHB-VHS turn-on threshold | VVHB ON | 7.6 | 8.3 | 9 | V | 8V UVLO | 6 |
| VHB-VHS turn-off threshold | VVHB OFF | 7.1 | 7.8 | 8.5 | V | 8V UVLO | 6 |
| VHB-VHS UVLO hysteresis | VVHB HYS | 0.5 | V | 8V UVLO | 6 | ||
| Total quiescent VDD to VSS and COM supply current | IQDD | 150 | 300 | µA | HI=LI=0 V or 5 V, DC on/off state | 6 | |
| Quiescent VDD-COM supply current | IQCOM | 55 | 100 | µA | HI=LI=0 V or 5 V, DC on/off state | 6 | |
| Quiescent VDD-VSS supply current | IQVSS | 110 | 300 | µA | HI=LI=0 V or 5 V, DC on/off state | 6 | |
| Quiescent HB-HS supply current | IQBS | 85 | 180 | µA | HI=0 V or 5 V, HO in DC on/off state | 6 | |
| Bootstrap supply leakage current | IBL | 0.1 | 25 | µA | HB=HS=700 V, VDD=COM=0 V | 6 | |
| Input and enable high threshold | VINH, VENH | 1.7 | 2.1 | 2.5 | V | 6 | |
| Input and enable low threshold | VINL, VENL | 0.7 | 1 | 1.3 | V | 6 | |
| Input and enable threshold hysteresis | VINHYS, VENHYS | 1.1 | V | 7 | |||
| HI, LI input low bias current | IINL | -5 | 5 | µA | HI, LI = 0 V | 7 | |
| HI, LI input high bias current | IINH | 20 | 55 | µA | HI, LI = 5 V | 7 | |
| Pull down resistor on HI input pin | RHI | 100 | 200 | KΩ | HI, LI = 5 V | 7 | |
| Pull down resistor on LI input pin | RLI | 100 | 200 | KΩ | HI, LI = 5 V | 7 | |
| LO output high voltage | VDD-VLOH | 225 | 500 | mV | LI = 5V, ILO=-20mA | 7 | |
| HO output high voltage | VHB-VHOH | 225 | 500 | mV | HI = 5V, IHO=-20mA | 7 | |
| LO output low voltage | VLOL | 20 | 40 | mV | LI = 0V, ILO=20mA | 7 | |
| HO output low voltage | VHOL | 20 | 40 | mV | HI = 0V, IHO=20mA | 7 | |
| LO, HO output pull-down resistance | RLOL, RHOL | 1 | 2 | Ω | ILO=IHO=20mA | 7 | |
| LO, HO output pull-up resistance | RLOH, RHOH | 12.6 | 25 | Ω | ILO=IHO=-20mA | 7 | |
| HO, LO output sink current | IGPK- | 4 | A | HI=LI=0V, HO=LO=15V, PW<10us; ensured by design | 7 | ||
| HO, LO output source current | IGPK+ | 3.5 | A | HI=LI=5V, HO=LO=0V, PW<10us; ensured by design | 7 | ||
| VLI falling to VLO falling | tDLFF | 32 | 49 | ns | CLOAD = 0 pF, from VINL of LI to 90% of LO falling | 7 | |
| VHI falling to VHO falling | tDHFF | 32 | 49 | ns | CLOAD = 0 pF, from VINL of HI to 90% of HO falling | 7 | |
| VLI rising to VLO rising | tDLRR | 32 | 49 | ns | CLOAD = 0 pF, from VINH of LI to 10% of LO rising | 7 | |
| VHI rising to VHO rising | tDHRR | 32 | 49 | ns | CLOAD = 0 pF, from VINH of HI to 10% of HO rising | 7 | |
| VEN falling to VLO falling | tDLFF_SD | 32 | 49 | ns | CLOAD = 0 pF, from VENL of EN to 90% of LO falling | 7 | |
| VEN falling to VHO falling | tDHFF_SD | 32 | 49 | ns | CLOAD = 0 pF, from VENL of EN to 90% of HO falling | 7 | |
| VEN rising to VLO rising | tDLRR_EN | 32 | 49 | ns | CLOAD = 0 pF, from VENH of EN to 10% of LO rising | 7 | |
| VEN rising to VHO rising | tDHRR_EN | 32 | 49 | ns | CLOAD = 0 pF, from VENH of EN to 10% of HO rising | 7 | |
| Delay matching HI OFF, LI ON | tMON | 5 | ns | TJ = 25°C, /tDHFF, tDLRR/ | 7 | ||
| Delay matching HI OFF, LI ON | tMON | 6 | ns | TJ = -40°C to 150°C, /tDHFF, tDLRR/ | 7 | ||
| Delay matching LI OFF, HI ON | tMOFF | 5 | ns | TJ = 25°C, /tDLFF, tDHRR/ | 7 | ||
| Delay matching LI OFF, HI ON | tMOFF | 6 | ns | TJ = -40°C to 150°C, /tDLFF, tDHRR/ | 7 | ||
| Minimum HI/LI ON pulse that changes output state | tON | 11 | 20 | ns | 0 V to 5 V input signal on HI & LI pins, CLOAD = 1nF | 8 | |
| Minimum HI/LI OFF pulse that changes output state | tOFF | 11 | 20 | ns | 5 V to 0 V input signal on HI & LI pins, CLOAD = 1nF | 8 |
CAD (KiCad official)
- Symbol:
UCC27735QDRQ1 - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
ucc27735qdrq1-etched.step/ucc27735qdrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ucc27735qdrq1.step/ucc27735qdrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (40 pp, sha256
04c832fde7f35be6, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).