component
SMB5355A
Public Made by Adomby adom
XCH(旭昌辉) , SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMB5355A
XCH(旭昌辉) · IC · SMB
SMB5355A from XCH(旭昌辉), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band; goes positive relative to the anode in zener (reverse) operation, with a nominal zener voltage of 18 V (17.10 to 18.90 V) for SMB5355A. |
| 2 | A | passive | Anode, the end without the color band; the maximum forward voltage is 1.2 V at 200 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XCH(旭昌辉) |
| Package | SMB |
| Category | |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal zener voltage (VZ AVE.) with min/max limits | VZ | 17.1 | 18 | 18.9 | V | IZT = 2.5 mA; standard ±5% tolerance per remark | 3 |
| Maximum zener impedance | ZZT | 65 | Ω | @IZT = 2.5 mA | 3 | ||
| Maximum zener impedance | ZZK | 75 | Ω | @IZK = 1.00 mA | 3 | ||
| Maximum reverse leakage current | IR | 0.5 | uA | @VR = 13.7 V | 3 | ||
| Maximum DC zener current | IZM | 265 | mA | 3 | |||
| Maximum forward voltage | VF | 1.2 | V | if = 200mA | 1 | ||
| DC power dissipation | PD | 5 | W | TL = 75 °C (note 1: lead temperature at 3/8 in (9.5 mm) from body) | 1 | ||
| Junction temperature range | TJ | -55 | 150 | ℃ | 1 | ||
| Storage temperature range | TJ,TSTG | -55 | 150 | ℃ | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 65 | ℃/W | note 2: junction to ambient, mounted on 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | （2）Thermal resistance from junction to ambient and from junction to lead mounted on P. 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas. | 1 |
CAD (KiCad official)
- Symbol:
SMB5355A - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
smb5355a-etched.step/smb5355a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smb5355a.step/smb5355a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XCH(旭昌辉) datasheet (3 pp, sha256
cc44843246128500, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).