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Contents

README

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TMCS1108A3UQDRQ1

Texas Instruments · Current Sensors · SOIC-8

TMCS1108A3UQDRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN+ passive Positive input current pin, connected internally to pin 2 through the 1.8 mΩ isolated leadframe conductor; current flowing into IN+ is positive.
2 IN+ passive Positive input current pin, connected internally to pin 1 through the 1.8 mΩ isolated leadframe conductor; rated ±120 V absolute max relative to GND.
3 IN- passive Negative input current pin, connected internally to pin 4 through the 1.8 mΩ isolated leadframe conductor; rated ±120 V absolute max relative to GND.
4 IN- passive Negative input current pin, connected internally to pin 3 through the 1.8 mΩ isolated leadframe conductor; recommended ±100 V peak operating voltage relative to GND.
5 GND power_in Ground reference for the low-voltage signal chain; IN+ and IN- voltages are specified relative to this pin.
6 NC unconnected No connect; the pin tolerates capacitive or resistive connection to GND or VS and shorting to GND is recommended if acceptable, with 1 MΩ input impedance and abs max GND-0.3 V to VS+0.3 V.
7 VOUT output Analog output voltage proportional to input current (200 mV/A for A3 variant), with 1 nF max capacitive load and abs max GND-0.3 V to VS+0.3 V.
8 VS power_in Analog supply, operating 3 V to 5.5 V (abs max 6 V), decoupled with a 0.1 µF low-ESR capacitor to GND close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Sensors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Sensitivity error (25°C) 0.4 1.2 % 0.05V ≤ VOUT ≤ VS, 0.2V, TA = 25ºC; ± as printed 6
Sensitivity error incl. lifetime and environmental drift 0.7 1.8 % 0.05V ≤ VOUT ≤ VS, 0.2V, TA = 25ºC; ± as printed 6
Sensitivity error (-40 to 85°C) 0.7 1.8 % 0.05V ≤ VOUT ≤ VS, 0.2V, TA = -40ºC to +85ºC; ± as printed 6
Sensitivity error (-40 to 125°C) 0.9 2.25 % 0.05V ≤ VOUT ≤ VS, 0.2V, TA = -40ºC to +125ºC; ± as printed 6
Output voltage offset error VOE 5 12 mV TMCS1108A3U-Q1; ± as printed 6
Output voltage offset drift 20 80 µV/℃ TMCS1108A3U-Q1, TA = -40ºC to +125ºC; ± as printed 7
Offset error, RTI IOS 25 60 mA TMCS1108A3U-Q1; ± as printed 7
Offset error temperature drift, RTI 100 400 µA/°C TMCS1108A3U-Q1, TA = -40ºC to +125ºC; ± as printed 7
Power supply rejection ratio PSRR 1 6.5 mV/V VS = 3V to 5.5V, TA = -40ºC to +125ºC; ± as printed 7
Sensitivity 200 mV/A TMCS1108A3U-Q1 6
Nonlinearity error 0.5 % VOUT = 0.5V to VS, 0.5V; ± as printed 6
Common-mode transient immunity CMTI 50 kV/µs 7
Common-mode rejection ratio, RTI CMRR 5 uA/V DC to 60Hz 7
Zero-current VOUT VOUT,0A 0.1 V/V TMCS1108AxU-Q1, 0.1*VS 7
Junction-to-ambient thermal resistance RθJA 36.6 °C/W D (SOIC) 8-pin, on TMCS1108EVM 5
Junction-to-case (top) thermal resistance RθJC(top) 50.7 °C/W D (SOIC) 8-pin, on TMCS1108EVM 5
Junction-to-board thermal resistance RθJB 9.6 °C/W D (SOIC) 8-pin, on TMCS1108EVM 5
Junction-to-top characterization parameter ΨJT -0.1 °C/W D (SOIC) 8-pin, on TMCS1108EVM 5
Junction-to-board characterization parameter ΨJB 11.7 °C/W D (SOIC) 8-pin, on TMCS1108EVM 5
Maximum power dissipation (both sides) PD 673 mW VS = 5.5V, TA = 125℃, TJ = 150℃, on TMCS1108EVM 5
Maximum power dissipation (current input, side 1) PD1 640 mW IIN = 16A; VS = 5.5V, TA = 125℃, TJ = 150℃, on TMCS1108EVM 5
Maximum power dissipation (side 2) PD2 33 mW VS = 5.5V, IQ = 6mA, no VOUT load 5

CAD (KiCad official)

  • Symbol: TMCS1108A3UQDRQ1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tmcs1108a3uqdrq1-etched.step / tmcs1108a3uqdrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmcs1108a3uqdrq1.step / tmcs1108a3uqdrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 9fc50849c6b5677d, retrieved 2026-10-27, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF