component
PMEG040V030EPE-QZ
Public Made by Adomby adom
Nexperia Schottky Diodes, TO-277. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG040V030EPE-QZ
Nexperia · Schottky Diodes · TO-277
PMEG040V030EPE-QZ from Nexperia, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the Schottky barrier rectifier; one of two anode leads listed in Table 2 for the CFP15B package. |
| 2 | A | passive | Anode of the Schottky barrier rectifier; one of two anode leads listed in Table 2 for the CFP15B package. |
| 3 | K | passive | Cathode of the Schottky barrier rectifier; the datasheet identifies the cathode tab as the soldering point for the junction-to-solder-point thermal resistance (Rth(j-sp) 3 K/W max). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 40 | V | Tj = 25 °C | 2 | ||
| Forward current | IF | 4.2 | A | δ = 1; Tsp ≤ 172 °C | 2 | ||
| Average forward current | IF(AV) | 3 | A | square-wave pulse; δ = 0.5; f = 20 kHz; Tsp ≤ 173 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 120 | A | half sine-wave pulse; tp = 8.3 ms; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 1.66 | W | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint [1] | 2 | ||
| Total power dissipation | Ptot | 2.15 | W | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [2] | 2 | ||
| Junction temperature | Tj | 175 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 175 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 175 | °C | 2 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 90 | K/W | in free air; FR4 PCB, single-sided copper, tin-plated, standard footprint [1][2] | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 70 | K/W | in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [1][3] | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 3 | K/W | soldering point of cathode tab [4] | 3 | ||
| Reverse breakdown voltage | V(BR)R | 40 | V | IR = 3 mA; pulsed; Tj = 25 °C [1] | 4 | ||
| Forward voltage | VF | 360 | 420 | mV | IF = 1 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 425 | 490 | mV | IF = 3 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 490 | 580 | mV | IF = 3 A; pulsed; Tj = -40 °C [1] | 4 | |
| Forward voltage | VF | 340 | 420 | mV | IF = 3 A; pulsed; Tj = 125 °C [1] | 4 | |
| Reverse current | IR | 30 | 120 | µA | VR = 40 V; pulsed; Tj = 25 °C [1] | 4 |
CAD (KiCad official)
- Symbol:
PMEG040V030EPE-QZ - Footprint:
Package_TO_SOT_SMD:TO-277A - 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files:
pmeg040v030epe-qz-etched.step/pmeg040v030epe-qz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg040v030epe-qz.step/pmeg040v030epe-qz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
2987a51f6cb01b74, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).