Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MMBZ18VA

JSMSEMI · TVS · SOT-23

MMBZ18VA from JSMSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of the first TVS diode, used unidirectionally against pin 3 with VRWM 14.5 V, VBR 17.10 to 18.90 V at 1.0 mA and VC 25 V at IPP 1.6 A.
2 K2 passive Cathode of the second TVS diode, used unidirectionally against pin 3 with VRWM 14.5 V, VBR 17.10 to 18.90 V at 1.0 mA and VC 25 V at IPP 1.6 A.
3 A passive Common anode of both TVS diodes, shared by pins 1 and 2; the datasheet allows either two unidirectional channels (1-3, 2-3) or one bidirectional configuration (1-2).

Key specifications

Parameter Value
Manufacturer JSMSEMI
Package SOT-23
Category TVS/Fuse/Board Level Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Power Dissipation (1.0 ms, TA=25°C), MMBZ12VA thru MMBZ33VA group PPK 40 W @ 1.0 ms, TA=25°C 1
Lead Solder Temperature (max, 10 s) TL 260 °C 10 s duration 1
Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Total Power Dissipation on FR-5 Board PD 225 mW FR-5 board, TA=25°C 1
Derate above 25°C, FR-5 Board 1.8 mW/°C above TA=25°C 1
Thermal Resistance Junction-to-Ambient, FR-5 Board RθJA 556 °C/W FR-5 board 1
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate, TA=25°C 1
Derate above 25°C, Alumina Substrate 2.4 mW/°C above TA=25°C 1
Thermal Resistance Junction-to-Ambient, Alumina Substrate RθJA 417 °C/W Alumina substrate 1
Maximum Reverse Leakage Current IR 50 nA @ VRWM 2
Working Peak Reverse Voltage VRWM 14.5 V 2
Breakdown Voltage (unidirectional) VBR 17.1 18 18.9 V IT = 1.0 mA, TA=25°C 2
Maximum Temperature Coefficient of VBR θVBR 15.3 mV/°C 2
Forward Voltage VF 0.9 V IF = 10 mA 2
Clamping Voltage VC 25 V @ IPP = 1.6 A 2

CAD (KiCad official)

  • Symbol: MMBZ18VA
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: JSMSEMI datasheet (5 pp, sha256 086b405f4e1e2f6a, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF