component
TPS2042BDGNR
Public Made by Adomby adom
Texas Instruments AC-DC Controllers and Regulators, MSOP-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS2042BDGNR
Texas Instruments · AC-DC Controllers and Regulators · MSOP-8-EP
TPS2042BDGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Device ground return. The PowerPAD on the DGN (HVSSOP) package is internally tied to GND and must be soldered to the board GND plane for heat sinking. |
| 2 | IN | power_in | Input supply voltage to both power-switch MOSFETs, 2.7 V to 5.5 V. Requires local bypass (typ. 0.1 µF) close to the pin. |
| 3 | /EN1 | input | Active-low enable for channel 1 (IN→OUT1). Logic low turns the channel-1 switch on. TPS2042B is the active-low variant; TPS2052B pinout is otherwise identical but uses active-high EN1. |
| 4 | /EN2 | input | Active-low enable for channel 2 (IN→OUT2). Logic low turns the channel-2 switch on. Independent of /EN1. |
| 5 | /OC2 | output | Overcurrent flag for channel 2. Open-drain, active-low; asserts when the channel-2 switch is in current-limit, thermal-shutdown, or reverse-voltage conditions. Requires an external pull-up resistor. Deglitched to suppress spurious pulses. |
| 6 | OUT2 | power_out | Power-switch output for channel 2 (IN→OUT2). 500 mA continuous, 1 A typical current limit. Connect a bulk output capacitor (typ. 22 µF) plus local decoupling (0.1 µF) to the load. |
| 7 | OUT1 | power_out | Power-switch output for channel 1 (IN→OUT1). 500 mA continuous, 1 A typical current limit. Connect a bulk output capacitor (typ. 22 µF) plus local decoupling (0.1 µF) to the load. |
| 8 | /OC1 | output | Overcurrent flag for channel 1. Open-drain, active-low; asserts when the channel-1 switch is in current-limit, thermal-shutdown, or reverse-voltage conditions. Requires an external pull-up resistor. Deglitched to suppress spurious pulses. |
| PAD | PowerPAD | power_in | Exposed thermal pad on the underside of the DGN (HVSSOP) package. Internally tied to GND; must be soldered to the PCB GND plane for the specified thermal impedance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
TPS2042BDGNRTPS2042BDGNRDTPS2042BDGNRDR
CAD (KiCad official)
- Symbol:
TPS2042BDGNR - Footprint:
Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm - 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
tps2042bdgnr-etched.step/tps2042bdgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps2042bdgnr.step/tps2042bdgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (59 pp, sha256
4707b7d224561b54, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).