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Contents

README

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IRLTS6342TRPBF

Infineon Technologies · MOSFETs · TSOP-6

IRLTS6342TRPBF from Infineon Technologies, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain of the N-channel HEXFET; drain-to-source voltage is rated 30 V and continuous drain current is 8.3 A at TA = 25°C.
2 D passive Drain of the N-channel HEXFET; drain-to-source voltage is rated 30 V and continuous drain current is 8.3 A at TA = 25°C.
3 G input Gate of the N-channel HEXFET; gate-to-source voltage is limited to ±12 V.
4 S passive Source of the N-channel HEXFET; the integral body diode runs source-to-drain with a maximum VSD of 1.2 V at IS = 8.3 A.
5 D passive Drain of the N-channel HEXFET; drain-to-source voltage is rated 30 V and continuous drain current is 8.3 A at TA = 25°C.
6 D passive Drain of the N-channel HEXFET; drain-to-source voltage is rated 30 V and continuous drain current is 8.3 A at TA = 25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TSOP-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDS 30 V 1
Gate-to-Source Voltage VGS -12 12 V 1
Continuous Drain Current ID 8.3 A @ TA = 25°C, VGS @ 4.5V 1
Continuous Drain Current ID 6.7 A @ TA = 70°C, VGS @ 4.5V 1
Pulsed Drain Current IDM 64 A Repetitive rating; pulse width limited by max. junction temperature 1
Power Dissipation PD 2 W @ TA = 25°C 1
Power Dissipation PD 1.3 W @ TA = 70°C 1
Linear Derating Factor 0.02 W/°C 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Drain-to-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 250μA 2
Static Drain-to-Source On-Resistance RDS(on) 14 17.5 mΩ VGS = 4.5V, ID = 8.3A 2
Static Drain-to-Source On-Resistance RDS(on) 17.5 22 mΩ VGS = 2.5V, ID = 6.7A 2
Gate Threshold Voltage VGS(th) 0.5 1.1 V VDS = VGS, ID = 10μA 2
Drain-to-Source Leakage Current IDSS 1 μA VDS = 24V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 150 μA VDS = 24V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS = 12V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS = -12V 2
Forward Transconductance gfs 25 S VDS = 10V, ID = 6.4A 2
Continuous Source Current (Body Diode) IS 2 A 2
Pulsed Source Current (Body Diode) ISM 64 A 2
Diode Forward Voltage VSD 1.2 V TJ = 25°C, IS = 8.3A, VGS = 0V 2
Reverse Recovery Time trr 13 20 ns TJ = 25°C, IF = 6.4A, VDD = 24V, di/dt = 100/μs 2
Reverse Recovery Charge Qrr 5.8 8.7 nC TJ = 25°C, IF = 6.4A, VDD = 24V, di/dt = 100/μs 2
Junction-to-Ambient Thermal Resistance RθJA 62.5 °C/W When mounted on 1 ich square copper board; Rθ is measured at TJ of approximately 90°C 2

CAD (KiCad official)

  • Symbol: IRLTS6342TRPBF
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: irlts6342trpbf-etched.step / irlts6342trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irlts6342trpbf.step / irlts6342trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (8 pp, sha256 fae64e07ed0bbeae, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF