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SI2338DS-T1-BE3
Public Made by Adomby adom
Vishay Intertech MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSI2338DS-T1-BE3
Vishay Intertech · MOSFETs · SOT-23(TO-236)
SI2338DS-T1-BE3 from Vishay Intertech, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-source voltage VGS is limited to ±20 V (absolute maximum). |
| 2 | S | passive | Source terminal; continuous source-drain diode current IS is rated 2.1 A at TC = 25 °C. |
| 3 | D | passive | Drain terminal; drain-source voltage VDS is rated 30 V and continuous drain current ID is rated 6 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOT-23(TO-236) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 30 | V | 1 | |||
| Gate-source voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous drain current | ID | 6 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous drain current | ID | 5.5 | A | TA = 25 °C | 1 | ||
| Continuous drain current | ID | 4.4 | A | TA = 70 °C | 1 | ||
| Pulsed drain current | IDM | 25 | A | t = 300 μs | 1 | ||
| Continuous source-drain diode current | IS | 2.1 | A | TC = 25 °C | 1 | ||
| Continuous source-drain diode current | IS | 1.1 | A | TA = 25 °C | 1 | ||
| Maximum power dissipation | PD | 2.5 | W | TC = 25 °C | 1 | ||
| Maximum power dissipation | PD | 1.6 | W | TC = 70 °C | 1 | ||
| Maximum power dissipation | PD | 1.3 | W | TA = 25 °C | 1 | ||
| Maximum power dissipation | PD | 0.8 | W | TA = 70 °C | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering recommendations (peak temperature) | 260 | °C | peak temperature | 1 | |||
| Maximum junction-to-ambient | RthJA | 75 | 100 | °C/W | t 5 s | 1 | |
| Maximum junction-to-foot (drain) | RthJF | 40 | 50 | °C/W | Steady state | 1 | |
| Drain-source breakdown voltage | VDS | 30 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-source threshold voltage | VGS(th) | 1.2 | 2.5 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-source leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero gate voltage drain current | IDSS | 1 | μA | VDS = 30 V, VGS = 0 V | 2 | ||
| Zero gate voltage drain current | IDSS | 10 | μA | VDS = 30 V, VGS = 0 V, TJ = 70 °C | 2 | ||
| On-state drain current | ID(on) | 20 | A | VDS 5 V, VGS = 10 V | 2 | ||
| Drain-source on-state resistance | RDS(on) | 0.028 | Ω | VGS = 10 V, ID = 5.5 A | 2 | ||
| Drain-source on-state resistance | RDS(on) | 0.033 | Ω | VGS = 4.5 V, ID = 5 A | 2 | ||
| Total gate charge | Qg | 13 | nC | VDS = 15 V, VGS = 10 V, ID = 5.5 A | 2 | ||
| Total gate charge | Qg | 7 | nC | VDS = 15 V, VGS = 4.5 V, ID = 5.5 A | 2 | ||
| Gate resistance | Rg | 2.5 | 12.6 | 25.2 | Ω | f = 1 MHz | 2 |
| Turn-on delay time (VGEN = 4.5 V) | td(on) | 6 | 12 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Rise time (VGEN = 4.5 V) | tr | 20 | 30 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-off delay time (VGEN = 4.5 V) | td(off) | 14 | 21 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Fall time (VGEN = 4.5 V) | tf | 10 | 20 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Rise time (VGEN = 10 V) | tr | 11 | 20 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-off delay time (VGEN = 10 V) | td(off) | 20 | 30 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall time (VGEN = 10 V) | tf | 7 | 14 | ns | VDD = 15 V, RL = 3.4 Ω, ID 4.4 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Continuous source-drain diode current | IS | 2.1 | A | TC = 25 °C | 2 | ||
| Pulse diode forward current | ISM | 25 | A | 2 | |||
| Body diode voltage | VSD | 0.82 | 1.2 | V | IS = 4.4 A, VGS = 0 V | 2 | |
| Body diode reverse recovery time | trr | 13 | 20 | ns | IF = 4.4 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | |
| Body diode reverse recovery charge | Qrr | 6 | 12 | nC | 2 |
CAD (KiCad official)
- Symbol:
SI2338DS-T1-BE3 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236) (KiCad packages3D, STEP)
- 3D model files:
si2338ds-t1-be3-etched.step/si2338ds-t1-be3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si2338ds-t1-be3.step/si2338ds-t1-be3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (9 pp, sha256
032185a4f4ab4d3e, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).