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Contents

README

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DMG301NU-7

Diodes Incorporated · MOSFETs · SOT-23

DMG301NU-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate, ESD-protected (>6kV HBM) through an internal gate protection diode, with VGSS of 8V max and gate threshold of 0.7V to 1.1V at ID = 250µA.
2 S passive Source terminal of the N-channel MOSFET, with maximum body diode continuous current IS of 0.5A.
3 D passive Drain terminal of the N-channel MOSFET, with VDSS of 25V and continuous drain current of 0.26A at VGS = 4.5V, TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 25 V 2
Gate-Source Voltage VGSS 8 V 2
Continuous Drain Current (Note 6), TA = +25°C ID 0.26 A VGS = 4.5V, steady state, TA = +25°C 2
Continuous Drain Current (Note 6), TA = +70°C ID 0.21 A VGS = 4.5V, steady state, TA = +70°C 2
Continuous Drain Current (Note 6), TA = +25°C ID 0.23 A VGS = 2.7V, steady state, TA = +25°C 2
Continuous Drain Current (Note 6), TA = +70°C ID 0.18 A VGS = 2.7V, steady state, TA = +70°C 2
Pulsed Drain Current IDM 1.5 A 10μs pulse, duty cycle = 1% 2
Maximum Body Diode Continuous Current (Note 6) IS 0.5 A 2
Total Power Dissipation (Note 5) PD 0.32 W Device mounted on FR-4 PC board, minimum recommended pad layout, single sided (Note 5) 2
Total Power Dissipation (Note 6) PD 0.4 W Device mounted on FR-4 substrate PC board, 2oz copper, 1 inch square copper pad (Note 6) 2
Thermal Resistance, Junction to Ambient (Note 5) RθJA 369 °C/W Note 5 board (minimum recommended pad layout) 2
Thermal Resistance, Junction to Ambient (Note 6) RθJA 296 °C/W Note 6 board (2oz copper, 1 inch square pad) 2
Thermal Resistance, Junction to Case (Note 6) RθJC 115 °C/W Note 6 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage BVDSS 25 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 20V, VGS = 0V 2
Gate-Body Leakage IGSS 100 nA VGS = 8V, VDS = 0V 2
Gate Threshold Voltage VGS(th) 0.7 1.1 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 4 Ω VGS = 4.5V, ID = 0.4A 2
Static Drain-Source On-Resistance RDS(ON) 5 Ω VGS = 2.7V, ID = 0.2A 2
Diode Forward Voltage VSD 0.76 1.2 V VGS = 0V, IS = 0.29A 2
Input Capacitance Ciss 27.9 42 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2
Output Capacitance Coss 6.1 9.2 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2
Reverse Transfer Capacitance Crss 2 3 pF VDS = 10V, VGS = 0V, f = 1.0MHz 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Solderable per MIL-STD-202, Method 208  Lead Free Plating (Matte Tin Finish Annealed over Alloy 42 1

CAD (KiCad official)

  • Symbol: DMG301NU-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: dmg301nu-7-etched.step / dmg301nu-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmg301nu-7.step / dmg301nu-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 0287bdd65f1c8e91, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF