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Contents

README

markdown

BZX84C2V7LT1G

onsemi · Zener Diodes · SOT-23

BZX84C2V7LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode terminal of the Zener diode; the datasheet's pinout line reads 1-Anode for the BZX84C2V7LT1G.
2 NC unconnected No internal connection on this pin (listed as No Connection in the pinout and Style 8 package outline).
3 CATHODE passive Cathode terminal of the Zener diode; the cathode is identified by the polarity band on the package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (VZ1), min VZ1 2.5 2.7 2.9 V @ IZT1 = 5 mA 3
Maximum Zener Impedance (ZZT1) ZZT1 100 Ω @ IZT1 = 5 mA 3
Reverse Zener Voltage (VZ2) VZ2 1.9 2.4 V @ IZT2 = 1 mA 3
Maximum Zener Impedance (ZZT2) ZZT2 600 Ω @ IZT2 = 1 mA 3
Reverse Zener Voltage (VZ3) VZ3 3 3.6 V @ IZT3 = 20 mA 3
Maximum Zener Impedance (ZZT3) ZZT3 50 Ω @ IZT3 = 20 mA 3
Reverse Leakage Current IR 20 µA @ VR = 1 V 3
Maximum Temperature Coefficient of VZ VZ -3.5 0 mV/k @ IZT1 = 5 mA 3
Maximum Capacitance C 450 pF @ VR = 0, f = 1 MHz 3
Forward Voltage VF 0.9 V @ IF = 10 mA 2
Total Power Dissipation on FR-5 Board PD 250 mW FR-5 board (Note 1) @ TA = 25°C 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RJA 500 °C/W FR-5 board (Note 1) 2
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate (Note 2) @ TA = 25°C 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C2V7LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c2v7lt1g-etched.step / bzx84c2v7lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c2v7lt1g.step / bzx84c2v7lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 c7584b789ccd6592, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF