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Contents

README

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IRFR024NT

HXY MOSFET · MOSFETs · TO-252-2L

IRFR024NT from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET, rated for VGS ±20 V with a gate threshold voltage VGS(th) of 1.2 V to 2.5 V.
2 D passive Drain terminal of the N-channel MOSFET, rated for VDS of 60 V and continuous drain current ID of 30 A at TC=25℃.
3 S passive Source terminal of the N-channel MOSFET; the body diode has a maximum forward voltage VSD of 1.2 V at IS=1 A and TJ=25℃.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 22 26 mΩ VGS=10V, ID=15A 2
Static Drain-Source On-Resistance RDS(ON) 30 38 mΩ VGS=4.5V, ID=10A 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=48V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=48V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 23 A VG=VD=0V, Force Current 2
Pulsed Source Current ISM 46 A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V printed as ±20 1
Continuous Drain Current ID 30 A TC=25℃, VGS @ 10V 1
Continuous Drain Current ID 15 A TC=100℃, VGS @ 10V 1
Continuous Drain Current ID 5.6 A TA=25℃, VGS @ 10V 1
Continuous Drain Current ID 4.5 A TA=70℃, VGS @ 10V 1
Pulsed Drain Current IDM 46 A 1
Single Pulse Avalanche Energy EAS 25.5 mJ 1
Avalanche Current IAS 22.6 A 1
Total Power Dissipation PD 34.7 W TC=25℃ 1
Total Power Dissipation PD 2 W TA=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W surface mounted on 1 inch² FR-4 board with 2OZ copper (note 1) 2
Thermal Resistance Junction-Case RθJC 3.6 ℃/W note 1: surface mounted on 1 inch² FR-4 board with 2OZ copper 2

CAD (KiCad official)

  • Symbol: IRFR024NT
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: irfr024nt-etched.step / irfr024nt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irfr024nt.step / irfr024nt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 1a0edf6b856f61f0, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF