component
AP62401WU-7
Public Made by Adomby adom
Diodes Incorporated DC-DC Converters, TSOT-26. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownAP62401WU-7
Diodes Incorporated · DC-DC Converters · TSOT-26
AP62401WU-7 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground for the converter. |
| 2 | SW | power_out | Switching node that supplies power to the output; connect the output LC filter from SW to the output load. |
| 3 | VIN | power_in | Power input supplying the IC and the power MOSFETs; drive with a 4.2V to 18V source and bypass to GND with a suitably large capacitor. |
| 4 | FB | input | Feedback sensing terminal for the output voltage; connect to the resistive divider of the output (0.8V reference). |
| 5 | EN | input | Enable input: drive high to turn on and low to turn off, leave floating for automatic startup; precision 1.2V threshold for programming UVLO. |
| 6 | BST | passive | High-side gate drive boost input; a 100nF capacitor is recommended from BST to SW to power the high-side driver. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-26 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback Voltage | VFB | 0.792 | 0.8 | 0.808 | V | TA = +25°C, CCM | 5 |
| Feedback Voltage | VFB | 0.784 | 0.8 | 0.816 | V | CCM | 5 |
| LS Valley Current Limit | IVALLEY_LIMIT | 4 | 5.25 | 6.5 | A | From Source to Drain | 5 |
| VIN Power-on Reset Rising Threshold | POR | 3.9 | 4.15 | V | 5 | ||
| EN Logic High Threshold | VEN_H | 1.2 | 1.25 | V | 5 | ||
| EN Logic Low Threshold | VEN_L | 1.04 | 1.1 | V | 5 | ||
| EN Input Current | IEN | 1 | 1.5 | 2 | μA | VEN = 1V | 5 |
| EN Input Current | IEN | 7 | μA | VEN = 1.5V | 5 | ||
| Shutdown Supply Current | ISHDN | 1.5 | μA | VEN = 0V | 5 | ||
| Quiescent Supply Current (AP62401) | IQ | 440 | μA | VFB = 0.85V | 5 | ||
| VIN Undervoltage Lockout Falling Threshold | UVLO | 3.6 | V | 5 | |||
| High-Side Power MOSFET On-Resistance | RDS(ON)1 | 50 | mΩ | 5 | |||
| Low-Side Power MOSFET On-Resistance | RDS(ON)2 | 22 | mΩ | 5 | |||
| Oscillator Frequency | fSW | 800 | kHz | VOUT = 5V, CCM | 5 | ||
| Minimum On-Time | tON_MIN | 60 | ns | 5 | |||
| Minimum Off-Time | tOFF_MIN | 150 | ns | 5 | |||
| Soft-Start Time | tSS | 1 | ms | 5 | |||
| Thermal Shutdown | TSD | 160 | °C | 5 | |||
| Thermal Shutdown Hysteresis | THys | 20 | °C | 5 | |||
| Supply Voltage | VIN | 4.2 | 18 | V | 4 | ||
| Output Voltage | VOUT | 0.8 | 7 | V | 4 | ||
| Operating Ambient Temperature | TA | -40 | 85 | °C | 4 | ||
| Operating Junction Temperature | TJ | -40 | 125 | °C | 4 | ||
| Supply Pin Voltage | VIN | -0.3 | 20 | V | DC | 4 | |
| Supply Pin Voltage | VIN | -0.3 | 22 | V | 400ms | 4 | |
| Switch Pin Voltage | VSW | -1 | V | DC; upper limit is VIN + 0.3 | 4 | ||
| Switch Pin Voltage | VSW | -2.5 | V | 20ns; upper limit is VIN + 2.0 | 4 | ||
| Feedback Pin Voltage | VFB | -0.3 | 6 | V | 4 | ||
| Enable/UVLO Pin Voltage | VEN | -0.3 | 7 | V | 4 | ||
| Storage Temperature | TST | -65 | 150 | °C | 4 | ||
| Junction Temperature | TJ | 160 | °C | 4 | |||
| Lead Temperature | TL | 260 | °C | 4 | |||
| ESD Susceptibility HBM | HBM | -2000 | 2000 | V | Human Body Model | 4 | |
| ESD Susceptibility CDM | CDM | -500 | 500 | V | Charged Device Model | 4 | |
| Junction to Ambient Thermal Resistance | θJA | 70 | °C/W | TSOT26, FR-4, two-layer PCB, 2oz copper, minimum recommended pad layout | 4 | ||
| Junction to Case Thermal Resistance | θJC | 12 | °C/W | TSOT26, FR-4, two-layer PCB, 2oz copper, minimum recommended pad layout | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.0145 grams (Approximate) | 19 |
CAD (KiCad official)
- Symbol:
AP62401WU-7 - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-26 (KiCad packages3D, STEP)
- 3D model files:
ap62401wu-7-etched.step/ap62401wu-7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap62401wu-7.step/ap62401wu-7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (20 pp, sha256
e099e7d6b4f6ce3f, retrieved 2026-10-24, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).