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Contents

README

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BZX384-C3V9

Nexperia · Zener Diodes · SOD-323

BZX384-C3V9 from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (C selection) VZ 3.7 4.1 V IZ = 5 mA 5
Maximum differential resistance rdif 600 Ω IZ = 1 mA 5
Maximum differential resistance rdif 90 Ω IZ = 5 mA 5
Reverse current IR 3 μA VR = 1 V 5
Temperature coefficient SZ -3.5 0 mV/K IZ = 5 mA 5
Diode capacitance Cd 450 pF f = 1 MHz; VR = 0 V 5
Non-repetitive peak reverse current IZSM 6 A tp = 100 μs; square wave; Tj = 25 °C prior to surge 5
Working voltage tolerance (C series, approximately) -5 5 % BZX384-C series, approximately ±5 % 1
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 100 μs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 100 μs; δ ≤ 0.02 4
Forward current IF 250 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation Ptot 300 mW Tamb ≤ 25 °C; device mounted on FR4 PCB, standard footprint 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance junction to ambient Rth(j-a) 415 K/W in free air; device mounted on FR4 PCB, standard footprint 4
Thermal resistance junction to solder point Rth(j-sp) 110 K/W soldering point of cathode tab 4

CAD (KiCad official)

  • Symbol: BZX384-C3V9
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: bzx384-c3v9-etched.step / bzx384-c3v9-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx384-c3v9.step / bzx384-c3v9.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 a381ee1ec1ad5a2b, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF