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Contents

README

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KIA5N50SD

KIA Semicon Tech · MOSFETs · TO-252

KIA5N50SD from KIA Semicon Tech, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the N-channel MOSFET; the datasheet limits the gate-to-source voltage to ±30 V (VGSS).
2 Drain passive Drain terminal, rated for a drain-to-source voltage of 500 V (VDSS) with 5 A continuous drain current and 15 A pulsed drain current at TC=25 °C.
3 Source passive Source terminal, the reference for the gate-to-source voltage (±30 V max); the body diode has a forward voltage of 1.5 V max at IS=2 A.

Key specifications

Parameter Value
Manufacturer KIA Semicon Tech
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Breakdown Voltage BVDSS 500 V VGS=0V, ID=250uA 3
Drain-to-Source Leakage Current IDSS 1 uA VDS=500V, VGS=0V 3
Gate-to-Source Leakage Current IGSS -100 100 nA VGS=±30V, VDS=0V 3
Drain-to-Source ON Resistance RDS(ON) 1.38 1.55 Ω VGS=10V, ID=2.5A 3
Gate Threshold Voltage VGS(TH) 2.5 3.5 4.5 V VDS=VGS, ID=250uA 3
Forward Voltage VSD 1.5 V Is=2A, VGS=0V 3
Drain-to-Source Voltage VDSS 500 V 2
Gate-to-Source Voltage VGSS -30 30 V 2
Continuous Drain Current ID 5 A 2
Pulsed Drain Current IDM 15 A 2
Single Pulse Avalanche Energy EAS 80 mJ TJ=25 ºC, VDD=100V, VGS=10V, IL=4A, L=10mH, RG=25Ω 2
Power Dissipation PD 44.6 W 2
Derating Factor above 25°C PD 0.36 W/°C 2
Maximum Temperature for Soldering TL 260 ºC 2
Operating and Storage Temperature Range TJ&TSTG -55 150 ºC 2
Thermal Resistance, Junction-to-Case RθJC 2.8 ºC/W 2
Thermal Resistance, Junction-to-Ambient RθJA 120 ºC/W 2

CAD (KiCad official)

  • Symbol: KIA5N50SD
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: kia5n50sd-etched.step / kia5n50sd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); kia5n50sd.step / kia5n50sd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KIA Semicon Tech datasheet (5 pp, sha256 83838587c8906d4a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF