LT3063EMS8E#PBF from Analog Devices, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	REF/BYP	passive	Reference/bypass pin: a single capacitor to GND bypasses reference noise and soft-starts the reference (10nF typically gives 30µVRMS noise), it is actively pulled low in shutdown, it must be left floating if unused, and it must not be driven by active circuitry.
2	ADJ	input	Error amplifier inverting input that regulates to 600mV referenced to GND, with a typical 15nA bias current flowing out of the pin.
3	OUT	power_out	Output pin that supplies load power, requires a minimum 3.3µF output capacitor to prevent oscillations, and is actively discharged by an internal NMOS in shutdown; output range is 600mV to 19V.
4	OUT	power_out	Output pin that supplies load power, requires a minimum 3.3µF output capacitor to prevent oscillations, and is actively discharged by an internal NMOS in shutdown; output range is 600mV to 19V.
5	IN	power_in	Input supply pin with a 1.6V to 45V operating input range; a 1µF to 10µF bypass capacitor is advised when the device is more than six inches from the main input filter capacitor, and the pin withstands reverse voltage.
6	IN	power_in	Input supply pin with a 1.6V to 45V operating input range; a 1µF to 10µF bypass capacitor is advised when the device is more than six inches from the main input filter capacitor, and the pin withstands reverse voltage.
7	SHDN	input	Shutdown pin: pulling it low puts the device into a low-power state and turns the output off, it must not be driven below GND unless tied to IN, and it must be connected (tie to IN if unused).
8	GND	power_in	Ground pin; connect the bottom of the output-setting resistor divider directly to GND for optimum regulation and tie it to exposed pad pin 9 and the PCB ground.
9	GND	power_in	Exposed thermal pad that is GND, must be soldered to the PCB ground, and provides enhanced thermal performance; it must be tied directly to pin 8.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-8-EP
Category	Power Management ICs
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Minimum Input Voltage (ILOAD = 200mA)			1.6	2.1	V	ILOAD = 200mA	3
ADJ Pin Voltage (VIN = 2.1V, ILOAD = 1mA)	VADJ	594	600	606	mV	VIN = 2.1V, ILOAD = 1mA	3
ADJ Pin Voltage (E-, I-Grades)	VADJ	588	600	612	mV	2.1V < VIN < 45V, 1mA < ILOAD < 200mA (E-, I-Grades)	3
Line Regulation (LT3063 adjustable, E-, I-Grades)			0.5	4	mV	ILOAD = 1mA; ΔVIN = 2.1V to 45V (E-, I-Grades)	3
Load Regulation (LT3063 adjustable, E-, I-Grades)			0.3	4	mV	ILOAD = 1mA to 200mA; VIN = 2.1V (E-, I-Grades)	3
Dropout Voltage at 1mA (25°C)	VDROPOUT		65	110	mV	VIN = VOUT(NOMINAL), ILOAD = 1mA	3
Dropout Voltage at 1mA (over temperature)	VDROPOUT			180	mV	VIN = VOUT(NOMINAL), ILOAD = 1mA, full operating temperature range	3
Dropout Voltage at 10mA (25°C)	VDROPOUT		130	180	mV	VIN = VOUT(NOMINAL), ILOAD = 10mA	3
Dropout Voltage at 10mA (over temperature)	VDROPOUT			270	mV	VIN = VOUT(NOMINAL), ILOAD = 10mA, full operating temperature range	3
Dropout Voltage at 100mA (25°C)	VDROPOUT		250	290	mV	VIN = VOUT(NOMINAL), ILOAD = 100mA	3
Dropout Voltage at 100mA (over temperature)	VDROPOUT			430	mV	VIN = VOUT(NOMINAL), ILOAD = 100mA, full operating temperature range	3
Dropout Voltage at 200mA (25°C)	VDROPOUT		300	360	mV	VIN = VOUT(NOMINAL), ILOAD = 200mA	3
Dropout Voltage at 200mA (over temperature)	VDROPOUT			530	mV	VIN = VOUT(NOMINAL), ILOAD = 200mA, full operating temperature range	3
GND Pin Current at ILOAD = 0	IGND		45	90	µA	VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 0	3
GND Pin Current at ILOAD = 1mA	IGND		70	120	µA	VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 1mA	3
GND Pin Current at ILOAD = 10mA	IGND		225	500	µA	VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 10mA	3
GND Pin Current at ILOAD = 100mA	IGND		2	4	mA	VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 100mA	3
GND Pin Current at ILOAD = 200mA	IGND		5	10	mA	VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 200mA	3
ADJ Pin Bias Current	IADJ		15	60	nA		3
Shutdown Threshold (VOUT Off to On)		0.3		0.8	V	VOUT = Off to On	3
Shutdown Threshold (VOUT On to Off)		0.7		1.5	V	VOUT = On to Off	3
SHDN Pin Current			1.2		µA	VSHDN = 0V	3
SHDN Pin Current				3	µA	VSHDN = 45V	3
Quiescent Current in Shutdown			1.25	3	µA	VIN = 45V, VSHDN = 0V	3
Ripple Rejection (LT3063 adjustable)		70	85		dB	VIN, VOUT = 1.5V (AVG), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 200mA	3
Current Limit		220	320		mA	VIN = VOUT(NOMINAL) + 1V (Note 11), ΔVOUT = -5%	3
Input Reverse Leakage Current				1	mA	VIN = -45V, VOUT = 0	3
Output Discharge Time			0.75	2	ms	VOUT discharged to 10% of nominal, COUT = 10µF	3
Reverse Output Current (LT3063 adjustable)			2.5	15	µA	VOUT = 3.3, VIN = VSHDN = 2.1V (Note 4)	3
Input Voltage (supply range)	VIN	1.6		45	V	Operating supply range	1
Adjustable Output Voltage Range	VOUT	0.6		19	V	Adjustable version	12
Output Capacitor Minimum	COUT	3.3			µF	Minimum output capacitor to prevent oscillations	14
Output Capacitor ESR				3	Ω	With minimum 3.3µF output capacitor	14
IN Pin Voltage	VIN	-50		50	V		2
OUT Pin Voltage	VOUT	-1		20	V		2
Input to Output Differential Voltage		-50		50	V	Note 2	2
ADJ Pin Voltage	VADJ	-50		50	V		2
SHDN Pin Voltage		-50		50	V		2
REF/BYP Pin Voltage		-0.3		1	V		2
Operating Junction Temperature (LT3063E)	TJ	-40		125	°C	LT3063E grade	2
Storage Temperature Range	TSTG	-65		150	°C		2
Lead Temperature (Soldering, 10 sec)				300	°C	MS8E package only, 10 sec	2
Thermal Resistance Junction-to-Ambient (MSOP)	θJA	29		45	°C/W	MS8E MSOP package, depends on copper area	2
Thermal Resistance Junction-to-Case (MSOP)	θJC	5		10	°C/W	MS8E MSOP package	2
Thermal Limit Temperature			165		°C	Typical thermal limit temperature	17

CAD (KiCad official)

Symbol: LT3063EMS8E#PBF
Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
3D model: MSOP-8-EP (KiCad packages3D, STEP)
3D model files: lt3063ems8e-pbf-etched.step / lt3063ems8e-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3063ems8e-pbf.step / lt3063ems8e-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (22 pp, sha256 0b9b2267a000d3f3, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

LT3063EMS8E#PBF

Verified LT3063EMS8E#PBF

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README