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Contents

README

markdown

B550CQ-13-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SMC

B550CQ-13-F from Diodes Incorporated, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 50 V 2
Working Peak Reverse Voltage VRWM 50 V 2
DC Blocking Voltage VR 50 V 2
RMS Reverse Voltage VR(RMS) 35 V 2
Average Rectified Output Current IO 5 A 2
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms Single Half-Sine-Wave Superimposed on Rated Load 2
Electrostatic Discharge HBM HBM 4000 V 2
Electrostatic Discharge MM MM 400 V 2
Electrostatic Discharge CDM CDM 1 kV 2
Forward Voltage Drop B550C, B560C VF 0.575 0.7 V IF = 5.0A, TA = +25°C 2
Leakage Current @ Rated VR, TA = +25°C IR 0.5 mA @ Rated VR, TA = +25°C 2
Leakage Current @ Rated VR, TA = +100°C IR 20 mA @ Rated VR, TA = +100°C 2
Total Capacitance CT 300 pF VR = 4V, f = 1MHz 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Switching Speed tRR 16 ns IF=0.5A, IR=1A, IRR=0.25A (RG1) 2
Thermal Resistance, Junction to Terminal RϴJT 10 °C/W 2
Thermal Resistance, Junction to Ambient (Note 6) RϴJA 50 °C/W Note 6: unit mounted on PC board with 8.0mm2 copper pads as heatsink 2
Thermal Resistance, Junction to Ambient (Note 7) RϴJA 115 °C/W Note 7: MRP FR-4 PCB, 2oz 2
Thermal Resistance, Junction to Ambient (Note 8) RϴJA 30 °C/W Note 8: With 50mm × 50mm × 23mm Al heatsink 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: B550CQ-13-F
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: b550cq-13-f-etched.step / b550cq-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); b550cq-13-f.step / b550cq-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 48273026e7a2127a, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF