component
SMD26PL-TP
Public Made by Adomby adom
MCC(Micro Commercial Components) Schottky Barrier Diodes (SBD), SOD-123FL. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMD26PL-TP
MCC(Micro Commercial Components) · Schottky Barrier Diodes (SBD) · SOD-123FL
SMD26PL-TP from MCC(Micro Commercial Components), in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | 60 | V | 1 | ||||
| Maximum RMS Voltage | 42 | V | 1 | ||||
| Maximum DC Blocking Voltage | 60 | V | 1 | ||||
| Maximum DC Reverse Current | IR | 0.1 | mA | 1 | |||
| Forward Voltage | VF | 0.7 | V | IFM=2.0A; TJ=25°C | 1 | ||
| Average Forward Current | IF(AV) | 2 | A | TL=90°C | 1 | ||
| Surge Forward Current | IFSM | 50 | A | 8.3ms, Half Sine; TJ=25°C | 1 | ||
| Power Dissipation | PD | 1.68 | W | 1 | |||
| Operating Junction Temperature Range (SMD26PL~SMD210PL) | TJ | -65 | 150 | °C | 1 | ||
| Storage Temperature Range (SMD26PL~SMD210PL) | TSTG | -65 | 150 | °C | 1 | ||
| Typical Thermal Resistance Junction to Ambient | RθJA | 60 | °C/W | PC board mounted on 0.20.2''(55mm) copper pad area (Note 2) | 1 | ||
| Typical Thermal Resistance Junction to Case | RθJC | 30 | °C/W | PC board mounted on 0.20.2''(55mm) copper pad area (Note 2) | 1 | ||
| Typical Thermal Resistance Junction to Lead | RθJL | 21 | °C/W | PC board mounted on 0.20.2''(55mm) copper pad area (Note 2) | 1 |
CAD (KiCad official)
- Symbol:
SMD26PL-TP - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
smd26pl-tp-etched.step/smd26pl-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd26pl-tp.step/smd26pl-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC(Micro Commercial Components) datasheet (4 pp, sha256
83a59a30f10535fd, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).