component
BD9328EFJ-E2
Public Made by Adomby adom
ROHM Semicon DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBD9328EFJ-E2
ROHM Semicon · DC-DC Converters · SOIC-8
BD9328EFJ-E2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | passive | High-side gate drive boost input, with a 0.1µF capacitor C_BS to SW and a 22Ω series resistor R_BS in the typical application; voltage limited to VSW+7V. |
| 2 | VIN | power_in | Power input, operating range 4.2V to 18V (absolute maximum 20V). |
| 3 | SW | output | Power switching output between the integrated high-side and low-side FETs, rated -0.5V to +18V recommended and 20V absolute maximum. |
| 4 | GND | power_in | Ground pin; the thermal pad is to be shorted to GND. |
| 5 | FB | input | Feedback input to the error amplifier with a 0.9V (typ) feedback reference, set by the R_UP/R_DW divider. |
| 6 | COMP | output | Error amplifier output compensation node (RC network to ground) that sets the switching duty cycle and is limited by the SS pin voltage at startup. |
| 7 | EN | input | Enable input with a 1.2V (typ) threshold; leaving it open shuts down the IC, and EN fall time should be within 100µs, with a 20V maximum. |
| 8 | SS | passive | Soft start control input; a 10µA (typ) source charges the external capacitor (0.1µF gives 22ms typical soft-start time). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VIN | 4.2 | 12 | 18 | V | Recommended Operating Conditions, Ta= -40°C to +85°C | 3 |
| SW Voltage | VSW | -0.5 | 18 | V | Recommended Operating Conditions, Ta= -40°C to +85°C | 3 | |
| Output Current | ISW3 | 2 | A | Recommended Operating Conditions, Ta= -40°C to +85°C | 3 | ||
| Output Voltage Range | VRANGE | 0.9 | V | Recommended Operating Conditions; printed max is VIN x 0.7 (not a numeric value) | 3 | ||
| Supply Voltage | VIN | 20 | V | Ta = 25°C | 3 | ||
| Switch Voltage | VSW | 20 | V | Ta = 25°C | 3 | ||
| Power Dissipation for HTSOP-J8 | Pd | 3.76 | W | Note 1: derating 30.08 mW/°C above Ta ≥ 25°C; 4-layer 70.0mm x 70.0mm x 1.6mm board | 3 | ||
| Package Thermal Resistance junction-to-ambient | θja | 29.27 | °C /W | Note 2: mounted on 4-layer 50mm x 30mm x 1.6mm application board | 3 | ||
| Package Thermal Resistance junction-to-case | θjc | 3.75 | °C /W | Note 2: mounted on 4-layer 50mm x 30mm x 1.6mm application board | 3 | ||
| Operating Temperature Range | Topr | -40 | 85 | °C | 3 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 3 | ||
| Maximum Junction Temperature | Tjmax | 150 | °C | 3 | |||
| EN Voltage | VEN | 20 | V | 3 | |||
| All Other Pins | VOTH | 20 | V | 3 | |||
| FB Input Bias Current | IFB | 0.02 | 2 | µA | 3 | ||
| Feedback Voltage1 | VFB1 | 0.886 | 0.9 | 0.914 | V | Voltage Follower | 3 |
| Feedback Voltage2 | VFB2 | 0.882 | 0.9 | 0.918 | V | Ta=-25°C to +85°C | 3 |
| Hi/Lo-Side FET Leak Current | ILEAKN | 0 | 10 | µA | VIN= 18V, VSW= 0V / 18V | 3 | |
| Switch Current Limit | ILIMIT3 | 3 | A | 3 | |||
| Enable Sink Current | IEN | 90 | 180 | 270 | µA | VEN= 12V | 3 |
| Enable Threshold Voltage | VEN | 1 | 1.2 | 1.4 | V | 3 | |
| Under Voltage Lockout Threshold | VUVLO | 3.5 | 3.75 | 4 | V | VIN Rising | 3 |
| Soft Start Current | ISS | 5 | 10 | 15 | µA | VSS= 0 V | 3 |
| Operating Frequency | fOSC | 300 | 380 | 460 | kHz | 3 | |
| Circuit Current | ICC | 1.2 | 3 | mA | VFB= 1.5V, VEN= 12V | 3 | |
| Standby Current | IQUI | 15 | 27 | µA | VEN= 0V | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | (2) The input capacitors should be connected as close as possible to the VIN terminal. (3) When there is an unused area on the PCB, please arrange the copper foil plain of DC nodes, such as GND, VIN a | 13 |
CAD (KiCad official)
- Symbol:
BD9328EFJ-E2 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
bd9328efj-e2-etched.step/bd9328efj-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd9328efj-e2.step/bd9328efj-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (22 pp, sha256
c2f4ee418f57eab6, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).