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Contents

README

markdown

DGD2005S8-13

Diodes Incorporated · Gate Drive ICs · SO-8

DGD2005S8-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Low-side and logic fixed supply, recommended 10V to 20V (absolute maximum -0.3 to +24V).
2 HIN input Logic input for the high-side gate driver output, in phase with HO; Schmitt-triggered with internal pull down, VIH min 2.5V and VIL max 0.6V.
3 LIN input Logic input for the low-side gate driver output, in phase with LO; Schmitt-triggered with internal pull down, VIH min 2.5V and VIL max 0.6V.
4 COM power_in Low-side return (ground), common to the logic and low-side driver.
5 LO output Low-side gate drive output, 290mA source and 600mA sink typical short-circuit pulsed current, swings from COM to VCC.
6 VS power_in High-side floating supply return, recommended up to 200V offset (logic operation for VS of -5V to +200V).
7 HO output High-side gate drive output, 290mA source and 600mA sink typical short-circuit pulsed current, swings from VS to VB.
8 VB power_in High-side floating supply, recommended VS+10V to VS+20V (absolute maximum -0.3 to +224V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Power Supply Chip
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Logic 1 Input Voltage VIH 2.5 V 4
Logic 0 Input Voltage VIL 0.6 V 4
High Level Output Voltage, VBIAS - VO VOH 0.05 0.2 V IO = 2mA 4
Low Level Output Voltage VOL 0.02 0.1 V IO = 2mA 4
Offset Supply Leakage Current ILK 50 µA VB = VS = 200V 4
Quiescent VBS Supply Current IBSQ 20 75 130 µA VIN = 0V or 5V 4
Quiescent VCC Supply Current ICCQ 60 120 180 µA VIN = 0V or 5V 4
Logic 1 Input Bias Current IIN+ 5 20 µA VIN = 5V 4
Logic 0 Input Bias Current IIN- 2 µA VIN = 0V 4
VBS Supply Undervoltage Positive Going Threshold VBSUV+ 8 8.9 9.8 V 4
VBS Supply Undervoltage Negative Going Threshold VBSUV- 7.4 8.2 9 V 4
VCC Supply Undervoltage Positive Going Threshold VCCUV+ 8 8.9 9.8 V 4
VCC Supply Undervoltage Negative Going Threshold VCCUV- 7.4 8.2 9 V 4
Undervoltage Lockout Hysterisis VUVLOH 0.3 0.7 V 4
Output High Short Circuit Pulsed Current IO+ 130 290 mA VO = 0V, VIN = Logic 1, PW ≤ 10µs 4
Output Low Short Circuit Pulsed Current IO- 270 600 mA VO = 15V, VIN = Logic 0, PW ≤ 10µs 4
Turn-On Propagation Delay tON 100 300 ns VS = 0V 4
Turn-Off Propagation Delay tOFF 100 280 ns VS = 0V or 200V 4
Delay Matching tDM 30 ns 4
Turn-On Rise Time tR 90 220 ns VS = 0V 4
Turn-Off Fall Time tF 30 80 ns VS = 0V 4
High-Side Floating Supply Voltage VB -0.3 224 V TA = +25°C 3
Offset Supply Voltage Transient dVS/dt 50 V/ns TA = +25°C 3
Low-Side and Logic Fixed Supply Voltage VCC -0.3 24 V TA = +25°C 3
Power Dissipation PD 0.625 W TA = +25°C, JEDEC 2-layer FR-4 board 3
Thermal Resistance, Junction to Ambient RθJA 200 °C/W JEDEC 2-layer FR-4 board 3
Operating Junction Temperature TJ 150 °C TA = +25°C 3
Lead Temperature (Soldering, 10s) TL 300 °C 3
Storage Temperature Range TSTG -55 150 °C 3
High Side Floating Supply Offset Voltage VS 200 V Logic operation for VS of -5V to +200V 3
Low Side and Logic Fixed Supply Voltage VCC 10 20 V 3
Low Side Output Voltage VLO 0 V max is VCC 3
Logic Input Voltage VIN 0 5 V 3
Ambient Temperature TA -40 125 °C 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads. Solderable per MIL￾STD-202, Method 208  Weight: 0.075 grams (Approximate) 1

CAD (KiCad official)

  • Symbol: DGD2005S8-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: dgd2005s8-13-etched.step / dgd2005s8-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dgd2005s8-13.step / dgd2005s8-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (11 pp, sha256 eedd70ab5a2533c7, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF