ISL32173EIBZ from RENESAS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	B1	input	Channel 1 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
2	A1	input	Channel 1 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
3	RO1	tri_state	Channel 1 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
4	/EN	input	Group receiver output enable (active-low, assumed from overbar lost in text) internally pulled high to VCC; all outputs are enabled by driving it low and high impedance when EN is low and it is high.
5	RO2	tri_state	Channel 2 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
6	A2	input	Channel 2 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
7	B2	input	Channel 2 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
8	GND	power_in	Ground connection.
9	B3	input	Channel 3 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
10	A3	input	Channel 3 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
11	RO3	tri_state	Channel 3 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
12	EN	input	Group receiver output enable (active-high) internally pulled high to VCC; all outputs are enabled by driving it high, or connect to VCC through a 1kΩ or greater resistor if unused.
13	RO4	tri_state	Channel 4 receiver output: high if A-B ≥ 200mV, low if A-B ≤ -200mV, high if inputs are floating; high impedance when disabled.
14	A4	input	Channel 4 noninverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
15	B4	input	Channel 4 inverting receiver input, ±16.5kV IEC61000-4-2 ESD protected, RS-485/422 level.
16	VCC	power_in	System power supply input, 3.0V to 5.5V.

Key specifications

Parameter	Value
Manufacturer	RENESAS
Package	SOIC-16
Category	Interface ICs
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Input High Voltage	VIH1	2			V	VCC ≤3.6V	7
Input High Voltage	VIH2	2.2			V	VCC ≤ 5.5V	7
Logic Input Current	IIN1	-15		15	µA	EN, EN = 0V or VCC	7
Receiver Differential Threshold Voltage	VTH	-200		200	mV	-7V ≤ VCM ≤ 12V	7
Receiver Input Hysteresis	VTH		30		mV	VCM = 0V, 25°C	7
Input Current (A, B)	IIN3			0.2	mA	VCC = 0V or 5.5V, VIN = 12V	8
Input Current (A, B)	IIN3	-0.2			mA	VCC = 0V or 5.5V, VIN = -7V	8
Receiver Input Resistance	RIN	48			kΩ	-7V ≤ VCM ≤ 12V	8
Receiver Output Leakage Current	IOZ	-10		10	µA	EN = 0V, 0 ≤ VO ≤ VCC	8
Receiver Short-Circuit Current (80Mbps versions)	IOS	-165		165	mA	EN = 1, 0V ≤ VO ≤ VCC	8
Receiver Output High Voltage	VOH1	2.4			V	IO = -6mA, VID = 200mV, VCC ≥ 3.0V	8
No Load Supply Current, 80Mbps Versions	80ICC			15	mA	EN = 1, or EN = 0	8
Shutdown Supply Current	ISHDN			15	µA	All outputs disabled (Note 18)	8
ESD RS-485 Pins (A, B) IEC61000-4-2 Air gap			16.5		kV	from bus pins to GND, 25°C	8
ESD RS-485 Pins (A, B) IEC61000-4-2 Contact			8		kV	from bus pins to GND, 25°C	8
ESD RS-485 Pins (A, B) Human Body Model			15		kV	from bus pins to GND, 25°C	8
ESD All Pins HBM			8		kV	25°C	9
ESD Machine Model			500		V	25°C	9
Maximum Data Rate	fMAX	80			Mbps	VID = ±1.5V, CL ≤ 15pF, VCC ≤ 3.6V	9
Maximum Data Rate	fMAX	20			Mbps	VID = ±1.5V, CL ≤ 15pF, VCC > 3.6V	9
Receiver Input to Output Delay	tPLH, tPHL	6	11	16	ns	(Figure 6)	9
Receiver Skew / tPLH - tPHL /	tSKD		0.4	2	ns	(Figure 6)	9
Prop Delay Skew Channel-to-Channel	tSKC-C		0.7	4	ns	(Figure 6, Note 11)	9
Prop Delay Skew Part-to-Part	tSKP-P		1.2	8	ns	(Figure 6, Note 12)	9
Receiver Disable from Output High	tHZ		18	30	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 7)	9
Receiver Disable from Output Low	tLZ		19	30	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7)	9
Receiver Enable from Shutdown to Output High	tZH(SHDN)			850	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 7, Notes 16, 20)	10
Receiver Enable from Shutdown to Output Low	tZL(SHDN)			850	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7, Notes 16, 20)	10
Supply Voltage VCC to GND	VCC			7	V		7
EN Input Voltage	EN	-0.3		7	V	EN (All varieties)	7
A, B Input Voltage	A, B	-9		13	V		7
RO Output Voltage (lower bound)	RO	-0.5			V	upper limit (VCC + 0.3V), Note 5	7
Maximum Junction Temperature				150	°C	Plastic Package	7
Storage Temperature Range		-65		150	°C		7
Supply Voltage	VCC	3		5.5	V		7
Operating Temperature Range		-40		85	°C	ISL32x7xEI	7
Bus Pin Common-Mode Voltage Range		-7		12	V		7
RO Output Current		-9		9	mA		7
RO Load Capacitance				6	pF		7
Thermal Resistance Junction to Ambient	θJA		78		°C/W	16 Ld SOIC Package (Notes 6, 9)	7
Thermal Resistance Junction to Case	θJC		30		°C/W	16 Ld SOIC Package (Notes 6, 9)	7

CAD (KiCad official)

Symbol: ISL32173EIBZ
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: isl32173eibz-etched.step / isl32173eibz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl32173eibz.step / isl32173eibz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: RENESAS datasheet (23 pp, sha256 644e4e76e1e830b9, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ISL32173EIBZ

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3D Model

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Schematic Symbol

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