component
LMR14006XDDCR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, TSOT-23-6. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownLMR14006XDDCR
Texas Instruments · DC-DC Converters · TSOT-23-6
LMR14006XDDCR from Texas Instruments, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CB | passive | Bootstrap capacitor pin providing gate-bias voltage for the internal high-side SW FET. Connect a Cboot capacitor (typically a small ceramic) between CB and SW. Operating range CB to SW is -0.3 V to 6 V. |
| 2 | GND | power_in | Ground connection. Device analog and power ground return. |
| 3 | FB | input | Feedback pin. Set feedback voltage divider ratio with VOUT = VFB × (1 + R1/R2). Internal reference (VFB) is typically 0.765 V (0.747 V to 0.782 V). |
| 4 | /SHDN | input | Enable/disable input pin (high-voltage tolerant, 0 V to 40 V). Has an internal pull-up current source: float to enable, pull below ~1.2 V to disable. Rising threshold ~1.25 V. Can be used with an external divider to set input UVLO. |
| 5 | VIN | power_in | Power input voltage pin. Supplies internal circuitry and is the drain node of the internal high-side MOSFET. Operating range 4 V to 40 V; absolute max 45 V. |
| 6 | SW | output | Switch node. Connect to the external inductor, catch/Schottky diode, and the bootstrap (Cboot) capacitor. Operating range -1 V to 40 V (transient -2 V to 45 V for <30 ns). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSOT-23-6 |
| Category | PMIC |
| Pins | 6 |
Ordering variants
Same part, different packaging or reel option.
LMR14006XDDCRLMR14006XDDCRDDCT
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating input voltage | VIN | 4 | 40 | V | 5 | ||
| Rising SHDN threshold voltage | VSHDN_Threshold | 1.05 | 1.25 | 1.38 | V | 5 | |
| Feedback voltage | VFB | 0.747 | 0.765 | 0.782 | V | 5 | |
| Switching frequency (LMR14006X) | fSW | 935 | 1100 | 1285 | kHz | LMR14006X | 5 |
| Shutdown supply current | ISHDN | 1 | 3 | µA | VEN = 0V | 5 | |
| Recommended operating VIN | VIN | 4 | 40 | V | 4 | ||
| Recommended operating CB | CB | 4 | 46 | V | 4 | ||
| Recommended operating CB to SW | CB to SW | -0.3 | 6 | V | 4 | ||
| Recommended operating SW | SW | -1 | 40 | V | 4 | ||
| Recommended operating FB | FB | 0 | 5.5 | V | 4 | ||
| Recommended operating SHDN | SHDN | 0 | 40 | V | 4 | ||
| Operating junction temperature range | TJ | -40 | 125 | °C | 4 | ||
| VIN to GND | VIN | -0.3 | 45 | V | 4 | ||
| SHDN to GND | SHDN | -0.3 | 45 | V | 4 | ||
| FB to GND | FB | -0.3 | 7 | V | 4 | ||
| CB to SW | CB to SW | -0.3 | 7 | V | 4 | ||
| SW to GND | SW | -1 | 45 | V | 4 | ||
| SW to GND transient | SW | -2 | 45 | V | less than 30ns transients | 4 | |
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 102 | °C/W | TSOT (6 pins), JEDEC 3in x 3in 4-layer board | 4 | ||
| Junction-to-case (top) thermal resistance | RθJCtop | 36.9 | °C/W | TSOT (6 pins), JEDEC 3in x 3in 4-layer board | 4 | ||
| Junction-to-board characterization parameter | RθJB | 28.4 | °C/W | TSOT (6 pins), JEDEC 3in x 3in 4-layer board | 4 | ||
| Operating quiescent current (non-switching) | IQ | 28 | µA | no load, VIN = 12V | 5 | ||
| Undervoltage lockout rising threshold | UVLO | 4 | V | Rising threshold | 5 | ||
| Undervoltage lockout falling threshold | UVLO | 3 | V | Falling threshold | 5 | ||
| SHDN input current | ISHDN_PIN | -4.2 | µA | SHDN = 2.3V | 5 | ||
| SHDN input current | ISHDN_PIN | -1 | µA | SHDN = 0.9V | 5 | ||
| SHDN hysteresis current | ISHDN_HYS | -3 | µA | 5 | |||
| High-side MOSFET on-resistance | RDS_ON | 600 | mΩ | VIN = 12V, CB to SW = 5.8V | 5 | ||
| Current limit | ILIMIT | 1200 | mA | VIN = 12V, TJ = 25°C | 5 | ||
| Thermal shutdown threshold | TSHDN | 170 | ºC | 5 | |||
| Thermal shutdown hysteresis | THYS | 10 | ºC | 5 | |||
| Minimum turn-on time | TON_MIN | 95 | ns | fSW = 2.1 MHz | 5 | ||
| Maximum duty cycle (LMR14006X) | DMAX | 96 | % | LMR14006X | 5 |
CAD (KiCad official)
- Symbol:
LMR14006XDDCR - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
lmr14006xddcr-etched.step/lmr14006xddcr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lmr14006xddcr.step/lmr14006xddcr.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
lmr14006xddcr.step |
97 KB | You want the bare part, or you mark your own boards. |
lmr14006xddcr-etched.step |
2.3 MB | You want the part with LMR14006XDDCR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 581 faces against 117 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (25 pp, sha256
338f9e367af06584, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).