SI8610EC-B-IS from Skyworks Solutions, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Side 1 power supply, operating range 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND1 placed close to the package.
2	A1	input	Side 1 digital input (Si8610 has one channel with its input on the VDD1 side) with Schmitt trigger input.
3	NC	unconnected	Listed as VDD1/NC for Si861x; not internally connected and can be left floating, tied to VDD, or tied to GND.
4	GND1	power_in	Side 1 ground.
5	GND2	power_in	Side 2 ground.
6	B1	output	Side 2 digital output of the single channel, with a nominal output impedance of about 50 Ω ±40%.
7	NC	unconnected	Listed as GND2/NC for Si861x; not internally connected and can be left floating, tied to VDD, or tied to GND.
8	VDD2	power_in	Side 2 power supply, operating range 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND2 placed close to the package.

Key specifications

Parameter	Value
Manufacturer	Skyworks Solutions
Package	SOIC-8
Category	Signal Isolation Devices
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VDD Undervoltage Threshold (rising)	VDDUV+	1.95	2.24	2.375	V	VDD1, VDD2 rising	11
VDD Undervoltage Threshold (falling)	VDDUV-	1.88	2.16	2.325	V	VDD1, VDD2 falling	11
VDD Undervoltage Hysteresis	VDDHYS	50	70	95	mV		11
Positive-Going Input Threshold	VT+	1.4	1.67	1.9	V	All inputs rising	11
Negative-Going Input Threshold	VT-	1	1.23	1.4	V	All inputs falling	11
Input Hysteresis	VHYS	0.38	0.44	0.5	V		11
High Level Input Voltage	VIH	2			V		11
Low Level Input Voltage	VIL			0.8	V		11
High Level Output Voltage (5 V table)	VOH		4.8		V	loh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 5 V ±10%	11
Low Level Output Voltage	VOL		0.2	0.4	V	lol = 4 mA	11
Input Leakage Current Si86xxxB/C/D	IL	-10		10	µA	Si86xxxB/C/D	11
Output Impedance	ZO		50		Ω		11
Si8610 DC Supply Current VDD1, VI = 0(Bx), 1(Ex)	IDD1		0.6	1.2	mA	All inputs 0 V or at supply; VI = 0(Bx), 1(Ex)	11
Si8610 DC Supply Current VDD2, VI = 0(Bx), 1(Ex)	IDD2		0.8	1.5	mA	All inputs 0 V or at supply; VI = 0(Bx), 1(Ex)	11
Si8610 DC Supply Current VDD1, VI = 1(Bx), 0(Ex)	IDD1		1.8	2.9	mA	All inputs 0 V or at supply; VI = 1(Bx), 0(Ex)	11
Si8610 DC Supply Current VDD2, VI = 1(Bx), 0(Ex)	IDD2		0.8	1.5	mA	All inputs 0 V or at supply; VI = 1(Bx), 0(Ex)	11
Si8610 1 Mbps Supply Current VDD1	IDD1		1.2	2	mA	All inputs = 500 kHz square wave, CL = 15 pF on all outputs	12
Si8610 1 Mbps Supply Current VDD2	IDD2		0.9	1.5	mA	All inputs = 500 kHz square wave, CL = 15 pF on all outputs	12
Si8610 10 Mbps Supply Current VDD1	IDD1		1.2	2	mA	All inputs = 5 MHz square wave, CL = 15 pF on all outputs	12
Si8610 10 Mbps Supply Current VDD2 (5 V table)	IDD2		1.2	2	mA	All inputs = 5 MHz square wave, CL = 15 pF on all outputs; VDD = 5 V ±10%	12
Si8610 100 Mbps Supply Current VDD1	IDD1		1.2	2	mA	All inputs = 50 MHz square wave, CL = 15 pF on all outputs	13
Si8610 100 Mbps Supply Current VDD2 (5 V table)	IDD2		4.8	6.7	mA	All inputs = 50 MHz square wave, CL = 15 pF on all outputs; VDD = 5 V ±10%	13
Data Rate		0		150	Mbps		13
Minimum Pulse Width				5	ns		13
Propagation Delay (5 V and 3.3 V tables)	tPHL, tPLH	5	8	13	ns	See Figure 4.1 Propagation Delay Timing	13
Pulse Width Distortion (5 V and 3.3 V tables)	PWD		0.2	4.5	ns	/tPLH, tPHL/; See Figure 4.1 Propagation Delay Timing	13
Propagation Delay Skew (5 V and 3.3 V tables)	tPSK(P-P)		2	4.5	ns		13
Channel-Channel Skew	tPSK		0.4	2.5	ns		13
Output Rise Time	tr		2.5	4	ns	CL = 15 pF; See Figure 4.1	14
Output Fall Time	tf		2.5	4	ns	CL = 15 pF; See Figure 4.1	14
Peak Eye Diagram Jitter	tJIT(PK)		350		ps	See Figure 2.3 Eye Diagram	14
Common Mode Transient Immunity Si86xxxB/C/D	CMTI	35	50		kV/µs	VI = VDD or 0 V, VCM = 1500 V; Si86xxxB/C/D	14
Start-up Time	tSU		15	40	µs		14
High Level Output Voltage (3.3 V table)	VOH		3.1		V	loh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 3.3 V ±10%	16
Si8610 10 Mbps Supply Current VDD2 (3.3 V table)	IDD2		1	1.8	mA	All inputs = 5 MHz square wave, CL = 15 pF on all outputs; VDD = 3.3 V ±10%	17
Si8610 100 Mbps Supply Current VDD2 (3.3 V table)	IDD2		3.4	5.1	mA	All inputs = 50 MHz square wave, CL = 15 pF on all outputs; VDD = 3.3 V ±10%	17
High Level Output Voltage (2.5 V table)	VOH		2.3		V	loh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 2.5 V ±5%	19
Si8610 10 Mbps Supply Current VDD2 (2.5 V table)	IDD2		1	1.6	mA	All inputs = 5 MHz square wave, CL = 15 pF on all outputs; VDD = 2.5 V ±5%	20
Si8610 100 Mbps Supply Current VDD2 (2.5 V table)	IDD2		2.7	4.4	mA	All inputs = 50 MHz square wave, CL = 15 pF on all outputs; VDD = 2.5 V ±5%	21
Propagation Delay (2.5 V table)	tPHL, tPLH	5	8	14	ns	See Figure 4.1 Propagation Delay Timing; VDD = 2.5 V ±5%	21
Pulse Width Distortion (2.5 V table)	PWD		0.2	5	ns	/tPLH, tPHL/; See Figure 4.1; VDD = 2.5 V ±5%	21
Propagation Delay Skew (2.5 V table)	tPSK(P-P)		2	5	ns	VDD = 2.5 V ±5%	21
Supply Voltage VDD1	VDD1	2.5		5.5	V		11
Supply Voltage VDD2	VDD2	2.5		5.5	V		11
Storage Temperature	TSTG	-65		150	°C		27
Operating Temperature	TA	-40		125	°C		27
Junction Temperature	TJ			150	°C		27
Supply Voltage	VDD1, VDD2	-0.5		7	V		27
Input Voltage	VI	-0.5			V	max printed as VDD + 0.5 V	27
Output Voltage	VO	-0.5			V	max printed as VDD + 0.5 V	27
Output Current Drive Channel	IO			10	mA		27
Lead Solder Temperature				260	°C	10 s	27
Maximum Isolation (Input to Output), SOIC-8				4500	VRMS	1 sec; SOIC-8 & DFN-8	27
IC Junction-to-Air Thermal Resistance, SOIC-8	θJA		140		°C/W	SOIC-8	26

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	PC		2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.	37

CAD (KiCad official)

Symbol: SI8610EC-B-IS
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: si8610ec-b-is-etched.step / si8610ec-b-is-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8610ec-b-is.step / si8610ec-b-is.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Skyworks Solutions datasheet (43 pp, sha256 e131307ab2df36e4, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8610EC-B-IS

Verified SI8610EC-B-IS

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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