component
PAM2320BECADJR
Public Made by Adomby adom
Diodes Incorporated DC-DC Converters, HSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownPAM2320BECADJR
Diodes Incorporated · DC-DC Converters · HSOP-8-EP
PAM2320BECADJR from Diodes Incorporated, in a HSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not connected, as stated in the pin description table. |
| 2 | VIN | power_in | Bias supply and chip main power supply pin, with supply voltage 2.7 V to 5.5 V and VIN absolute maximum of 6 V. |
| 3 | SW | output | Drains of the internal main and synchronous power MOSFETs, with SW pin voltage limited to -0.3 V to (VIN +0.3) V. |
| 4 | GND | power_in | Ground reference pin; all voltages are referenced to ground. |
| 5 | FB | input | Feedback voltage input to the internal error amplifier with a 0.6 V threshold, FB pin voltage limited to -0.3 V to (VIN +0.3) V. |
| 6 | NC | unconnected | Not connected, as stated in the pin description table. |
| 7 | EN | input | Enable control input: above 1.5 V enables the chip and below 0.3 V shuts down the device, with EN pin voltage limited to -0.3 V to +6.0 V. |
| 8 | NC | unconnected | Not connected, as stated in the pin description table. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | HSOP-8-EP |
| Category | Power Management ICs |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | VIN | 6 | V | 3 | |||
| SW Pin Voltage | -0.3 | V | max printed as (VIN +0.3) | 3 | |||
| FB Pin Voltage | -0.3 | V | max printed as (VIN +0.3) | 3 | |||
| EN Pin Voltage | -0.3 | 6 | V | 3 | |||
| Maximum Junction Temperature | 150 | °C | 3 | ||||
| Storage Temperature Range | -65 | 150 | °C | 3 | |||
| Soldering Temperature | 300 | °C | 5sec | 3 | |||
| Supply Voltage | 2.7 | 5.5 | V | 3 | |||
| Junction Temperature Range | -40 | 125 | °C | 3 | |||
| Ambient Temperature Range | -40 | 85 | °C | 3 | |||
| Thermal Resistance (Junction to Ambient) | θJA | 90 | °C/W | PSOP-8 | 3 | ||
| Thermal Resistance (Junction to Case) | θJC | 14 | °C/W | PSOP-8 | 3 | ||
| Internal Power Dissipation | PD | 1100 | mW | @TA= +25°C, PSOP-8 | 3 | ||
| Input Voltage Range | VIN | 2.7 | 5.5 | V | 4 | ||
| Output Voltage Range | VO | 0.6 | V | max printed as VIN | 4 | ||
| UVLO Threshold, VIN Rising | VUVLO | 2.4 | 2.5 | V | VIN Rising | 4 | |
| UVLO Hysteresis | 240 | mV | 4 | ||||
| UVLO Threshold, VIN Falling | VUVLO | 1.8 | V | VIN Falling | 4 | ||
| Regulated Output Voltage Accuracy | VO | -3 | 2 | % | IO = 0A to 3A | 4 | |
| Regulated Feedback Voltage | VFB | 0.591 | 0.6 | 0.609 | V | 4 | |
| FB Leakage Current | IFB | 0.2 | µA | VO = 1V | 4 | ||
| Output Voltage Line Regulation | LNR | 0.2 | %/V | VIN = 2.5V to 5V | 4 | ||
| Output Voltage Load Regulation | LDR | 0.5 | %/A | IO = 0A to 3A | 4 | ||
| Quiescent Current | IQ | 42 | 90 | µA | No Load | 4 | |
| Shutdown Current | ISD | 1 | µA | VEN = 0V | 4 | ||
| Current Limit | ILIM | 4 | A | 4 | |||
| Oscillator Frequency | fOSC | 1.2 | 1.5 | 1.8 | MHz | 4 | |
| Drain-Source On-State Resistance, High Side | RDS(ON) | 0.85 | mΩ | High Side | 4 | ||
| Drain-Source On-State Resistance, Low Side | RDS(ON) | 60 | mΩ | Low Side | 4 | ||
| High Efficiency | η | 95 | % | 4 | |||
| Analog Soft-Start Time | tS | 0.5 | 3 | ms | From enable to output regulation | 4 | |
| EN Threshold High | VEH | 1.5 | V | 4 | |||
| EN Threshold Low | VEL | 0.3 | V | 4 | |||
| EN Leakage Current | IEN | -1 | 1 | µA | VIN = VEN = 0V | 4 | |
| Over Temperature Protection | OTP | 150 | °C | 4 | |||
| OTP Hysteresis | OTH | 30 | °C | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.081 grams (Approximate) | 12 |
CAD (KiCad official)
- Symbol:
PAM2320BECADJR - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: HSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
pam2320becadjr-etched.step/pam2320becadjr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pam2320becadjr.step/pam2320becadjr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (13 pp, sha256
0e3f145ff95fc55b, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).