component
LM236M-2.5
Public Made by Adomby adom
HGSEMI Voltage Reference, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM236M-2.5
HGSEMI · Voltage Reference · SOP-8
LM236M-2.5 from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection pin on the SOP-8 package. |
| 2 | NC | unconnected | No connection pin on the SOP-8 package. |
| 3 | NC | unconnected | No connection pin on the SOP-8 package. |
| 4 | V- | power_in | Negative terminal (anode) of the 2.5V reference diode, used as ground; reverse current rated 400µA to 10mA operating, 15mA max. |
| 5 | ADJ | passive | Adjustment pin for trimming the reference breakdown voltage and temperature coefficient, e.g. with a 10kΩ potentiometer. |
| 6 | NC | unconnected | No connection pin on the SOP-8 package. |
| 7 | NC | unconnected | No connection pin on the SOP-8 package. |
| 8 | V+ | power_in | Positive terminal (cathode) of the 2.5V reference diode, typical 2.49V breakdown at 1mA, 400µA to 10mA operating current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VR | 2.44 | 2.49 | 2.54 | V | Tamb = +25°C, IR = 1mA | 3 |
| Reverse Breakdown Voltage Change with Current, Tamb = +25°C | VR | 3 | 10 | mV | 400µA ≤ IR ≤ 10mA, Tamb = +25°C | 3 | |
| Reverse Breakdown Voltage Change with Current, Tmin to Tmax | VR | 2.6 | 12 | mV | 400µA ≤ IR ≤ 10mA, Tmin ≤ Tamb ≤ Tmax | 3 | |
| Reverse Dynamic Impedance, Tamb = +25°C | ZD | 0.2 | 0.4 | Ω | IR = 1mA, Tamb = +25°C | 3 | |
| Reverse Dynamic Impedance, Tmin to Tmax | ZD | 1 | 1.4 | Ω | IR = 1mA, Tmin ≤ Tamb ≤ Tmax | 3 | |
| Temperature Stability | KVT | 1.8 | 6 | mV | VR = 2.49V, IR = 1mA | 3 | |
| Reverse Current | IRIF | 15 | mA | 3 | |||
| Forward Current | IRIF | 10 | mA | 3 | |||
| Operating Free-air Temperature Range (LM236-2.5) | Toper | -40 | 85 | °C | LM236-2.5 | 3 | |
| Storage Temperature Range | TStg | -65 | 150 | °C | 3 | ||
| Lead Temperature (Soldering) | TL | 260 | °C | 10 seconds | 3 |
CAD (KiCad official)
- Symbol:
LM236M-2.5 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
lm236m-2-5-etched.step/lm236m-2-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm236m-2-5.step/lm236m-2-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (12 pp, sha256
55ebb8983fca01ec, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).