component
SL0805125
Public Made by Adomby adom
TECHFUSE Resettable Fuses, 0805. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownSL0805125
TECHFUSE · Resettable Fuses · 0805
SL0805125 from TECHFUSE, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Trip current | IT | 2.5 | A | Minimum current at which device always trips, 25℃ still air, reflow 260℃ for 20 sec | 2 | ||
| Initial resistance, minimum | Rmin | 0.015 | Ω | Initial (un-soldered) state | 2 | ||
| Initial resistance, maximum | Rmax | 0.04 | Ω | Initial (un-soldered) state | 2 | ||
| Maximum resistance after reflow | R1max | 0.07 | Ω | 25℃, measured one hour after reflow soldering 260℃ for 20 sec; PWB with 0.030 in 1.5 oz copper traces | 2 | ||
| Hold current | IH | 1.25 | A | Maximum current at which device will not trip, 25℃ or 60℃ still air | 2 | ||
| Maximum continuous voltage | Vmax | 6 | V | Maximum continuous voltage withstood without damage at rated current | 2 | ||
| Maximum fault current | Imax | 50 | A | Withstood without damage at rated voltage | 2 | ||
| Maximum time to trip | Ttrip | 1 | S | At assigned trip current 8.0 A; reflow soldering 260℃ for 20 sec | 2 | ||
| Typical power dissipation | Pdtyp | 1 | W | Typical power dissipated by the device in the stated air environment | 2 | ||
| Resistance change, vibration | -5 | 5 | % | MIL-STD-883C, Method 2007.1, Condition A | 2 | ||
| Resistance after passive aging | R1max | 0.07 | Ω | Passive aging: 85℃, 1000 hours; criterion printed as ≤ R1max | 2 | ||
| Resistance after moisture resistance | R1max | 0.07 | Ω | 85% RH, 85℃, 1000 hrs; criterion printed as ≤ R1max | 2 | ||
| Resistance after thermal shock | R1max | 0.07 | Ω | MIL-STD-202 Method 107G, +85℃/-40℃, 20 times; criterion printed as ≤ R1max | 2 | ||
| Recommended storage temperature, maximum | 40 | ℃ | Recommended storage conditions | 2 | |||
| Recommended storage humidity, maximum | 70 | % R.H. | Recommended storage conditions | 2 | |||
| Hold current derating at ambient | IH | 1.9 | A | Maximum ambient operating temperature -40℃ | 3 | ||
| Hold current derating at ambient | IH | 1.6 | A | Maximum ambient operating temperature -20℃ | 3 | ||
| Hold current derating at ambient | IH | 1.4 | A | Maximum ambient operating temperature 0℃ | 3 | ||
| Hold current derating at ambient | IH | 1.25 | A | Maximum ambient operating temperature 25℃ | 3 | ||
| Hold current derating at ambient | IH | 1.1 | A | Maximum ambient operating temperature 40℃ | 3 | ||
| Hold current derating at ambient | IH | 0.9 | A | Maximum ambient operating temperature 50℃ | 3 | ||
| Hold current derating at ambient | IH | 0.8 | A | Maximum ambient operating temperature 60℃ | 3 | ||
| Hold current derating at ambient | IH | 0.7 | A | Maximum ambient operating temperature 70℃ | 3 |
CAD (KiCad official)
- Symbol:
SL0805125 - Footprint:
Fuse:Fuse_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
sl0805125-etched.step/sl0805125-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sl0805125.step/sl0805125.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECHFUSE datasheet (4 pp, sha256
7cbf94f435d86576, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).