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Contents

README

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BTB12-800CW

WEIDA · TRIACs · TO-263

BTB12-800CW from WEIDA, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 T1 passive Main terminal 1 of the triac (T1(1) in the symbol), the reference terminal for gate triggering; the device is rated for IT(RMS) 12 A.
2 T2 passive Main terminal 2 of the triac (T2(2) in the symbol), marked on the TO-263 drawing at the tab; blocks VDRM/VRRM of 600/800/1200 V depending on the variant.
3 G input Gate terminal (G(3) in the symbol); trigger current IGT is a maximum of 35 mA for the CW grade (VD=12V, RL=33Ω) and VGT is a maximum of 1.5 V.

Key specifications

Parameter Value
Manufacturer WEIDA
Package TO-263
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate trigger current IGT 35 mA VD=12V, RL=33Ω, quadrants I-II-III, CW 2
Gate trigger voltage VGT 1.5 V VD=12V, RL=33Ω, quadrants I-II-III 2
Gate non-trigger voltage VGD 0.2 V VD=VDRM, Tj=125℃, RL=3.3kΩ, quadrants I-II-III 2
Holding current IH 40 mA IT=100mA, CW 2
Latching current, quadrants I-III IL 50 mA IG=1.2IGT, quadrants I-III, CW 2
Latching current, quadrant II IL 60 mA IG=1.2IGT, quadrant II, CW 2
Critical rate of rise of off-state voltage dV/dt 500 V/µs VD=2/3VDRM, Tj=125℃, gate open, CW 2
On-state voltage VTM 1.5 V ITM=17A, tp=380μs, Tj=25℃ 3
Off-state/reverse leakage current IDRM/IRRM 5 µA VDRM=VRRM, Tj=25℃ 3
Off-state/reverse leakage current IDRM/IRRM 1 mA VDRM=VRRM, Tj=125℃ 3
Thermal resistance junction to case (AC) Rth(j-c) 1.5 ℃/W TO-263 3
Repetitive peak off-state voltage VDRM 800 V Tj=25℃ 1
Repetitive peak reverse voltage VRRM 800 V Tj=25℃ 1
RMS on-state current IT(RMS) 12 A 1
Non repetitive surge peak on-state current ITSM 120 A full cycle, F=50Hz 1
I2t value for fusing I2t 78 A2s tp=10ms 1
Critical rate of rise of on-state current dI/dt 50 A/μs IG=2×IGT 1
Peak gate current IGM 4 A 1
Average gate power dissipation PG(AV) 1 W 1
Peak gate power PGM 5 W 1
Storage junction temperature range Tstg -40 150 ℃ 1
Operating junction temperature range Tj -40 125 ℃ 1

CAD (KiCad official)

  • Symbol: BTB12-800CW
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: btb12-800cw-etched.step / btb12-800cw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); btb12-800cw.step / btb12-800cw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WEIDA datasheet (7 pp, sha256 464a37ab52cf58d7, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF