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ADX111AMSOP10
Public Made by Adomby adom
analogysemi Analog To Digital Converters (ADC), MSOP-10. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownADX111AMSOP10
analogysemi · Analog To Digital Converters (ADC) · MSOP-10
ADX111AMSOP10 from analogysemi, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ADDR | input | I2C slave address select; tying this pin to GND, VDD, SDA or SCL sets the device's slave address. |
| 2 | ALERT/RDY | output | Comparator output or conversion ready; open drain, connected to a pull-up resistor. |
| 3 | GND | power_in | Ground reference for the device. |
| 4 | AIN0 | input | Analog input 0. |
| 5 | AIN1 | input | Analog input 1. |
| 6 | AIN2 | input | Analog input 2. |
| 7 | AIN3 | input | Analog input 3. |
| 8 | VDD | power_in | Power supply; connect a 0.1 µF power-supply decoupling capacitor between this pin and GND. |
| 9 | SDA | bidirectional | Serial data; transmits and receives data. |
| 10 | SCL | input | Serial clock input; locks data on SDA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | analogysemi |
| Package | MSOP-10 |
| Category | Data Acquisition |
| Pins | 10 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power-Supply Voltage (VDD to GND) | -0.3 | 7 | V | VDD to GND | 4 | ||
| Digital Input Voltage (SDA, SCL, ADDR, ALERT/RDY) | 5.5 | V | 4 | ||||
| Input Current, Continuous | -10 | 10 | mA | Any pin except power supply pins | 4 | ||
| Operating Ambient Temperature | TA | -40 | 125 | °C | 4 | ||
| Junction Temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage Temperature | Tstg | -60 | 150 | °C | 4 | ||
| Power Supply (VDD to GND) | 2 | 5.5 | V | 5 | |||
| Full-Scale Input Voltage Range | FSR | 0.256 | 6.144 | V | VIN = V(AINP), V(AINN); printed as ±0.256 (min) and ±6.144 (max) | 5 | |
| Digital Input Voltage | VDIG | 5.5 | V | 5 | |||
| Operating Ambient Temperature | TA | -40 | 125 | °C | 5 | ||
| Data Rate Variation | -7 | 6 | % | All data rates | 6 | ||
| Integral Nonlinearity | INL | 0.5 | 1 | LSB | DR = 8SPS, FSR = ±2.048V | 6 | |
| Offset Error (differential inputs) | -2 | 0 | 2 | LSB | FSR = ±2.048V, differential inputs | 6 | |
| Offset Error (single-ended inputs) | -2 | 2 | LSB | FSR = ±2.048V, single-ended inputs | 6 | ||
| Gain Drift Over Temperature | 8 | 30 | ppm/°C | FSR = ±2.048V | 6 | ||
| Gain Error | 0.01 | 0.1 | % | FSR = ±2.048V, TA = 25°C | 6 | ||
| Gain Match | 0.01 | 0.05 | % | Match between any two gains | 6 | ||
| Gain Channel Match | 0.03 | 0.05 | % | Match between any two inputs | 6 | ||
| Common-Mode Rejection Ratio | CMRR | 110 | dB | At DC, FSR = ±0.256V | 6 | ||
| Common-Mode Rejection Ratio | CMRR | 105 | dB | At DC, FSR = ±2.048V | 6 | ||
| High-Level Input Voltage | VIH | 5.5 | V | 6 | |||
| Low-Level Output Voltage | VOL | 0.15 | 0.4 | V | IOL = 3mA | 6 | |
| Input Leakage Current | -10 | 10 | µA | GND < VDIG < VDD | 6 | ||
| Supply Current, Power-down | IVDD | 0.65 | 1 | µA | Power-down, TA = 25°C | 7 | |
| Supply Current, Power-down (full temperature range) | IVDD | 3.5 | µA | Power-down | 7 | ||
| Supply Current, Operating | IVDD | 145 | 170 | µA | Operating, TA = 25°C | 7 | |
| Supply Current, Operating (full temperature range) | IVDD | 300 | µA | Operating | 7 | ||
| Junction-to-Ambient Thermal Resistance (MSOP-10) | RθJA | 150 | °C/W | MSOP-10 package | 5 | ||
| Junction-to-Case (Top) Thermal Resistance (MSOP-10) | RθJC(top) | 54 | °C/W | MSOP-10 package | 5 | ||
| Junction-to-Board Thermal Resistance (MSOP-10) | RθJB | 90 | °C/W | MSOP-10 package | 5 | ||
| Junction-to-Top Characterization Parameter (MSOP-10) | ψJT | 3 | °C/W | MSOP-10 package | 5 | ||
| Junction-to-Board Characterization Parameter (MSOP-10) | ψJB | 86 | °C/W | MSOP-10 package | 5 | ||
| Junction-to-Case (Bottom) Thermal Resistance (MSOP-10) | RθJC(bot) | 90 | °C/W | MSOP-10 package | 5 | ||
| SCL Clock Frequency | fSCL | 0.01 | 0.4 | MHz | Fast mode | 8 | |
| SCL Clock Frequency | fSCL | 0.01 | 3.4 | MHz | High-speed mode | 8 | |
| Bus Free Time Between START and STOP Condition | tBUF | 600 | ns | Fast mode | 8 | ||
| Bus Free Time Between START and STOP Condition | tBUF | 160 | ns | High-speed mode | 8 | ||
| Hold Time After Repeated START Condition | tHDSTA | 600 | ns | Fast mode | 8 | ||
| Hold Time After Repeated START Condition | tHDSTA | 160 | ns | High-speed mode | 8 | ||
| Setup Time for A Repeated START Condition | tSUSTA | 600 | ns | Fast mode | 8 | ||
| Setup Time for A Repeated START Condition | tSUSTA | 160 | ns | High-speed mode | 8 | ||
| Setup Time for STOP Condition | tSUSTO | 600 | ns | Fast mode | 8 | ||
| Setup Time for STOP Condition | tSUSTO | 160 | ns | High-speed mode | 8 | ||
| Data Hold Time | tHDDAT | 0 | ns | Fast mode | 8 | ||
| Data Setup Time | tSUDAT | 100 | ns | Fast mode | 8 | ||
| Data Setup Time | tSUDAT | 10 | ns | High-speed mode | 8 | ||
| Low Period of the SCL Clock Pin | tLOW | 1300 | ns | Fast mode | 8 | ||
| Low Period of the SCL Clock Pin | tLOW | 160 | ns | High-speed mode | 8 | ||
| High Period for the SCL Clock Pin | tHIGH | 600 | ns | Fast mode | 8 | ||
| High Period for the SCL Clock Pin | tHIGH | 60 | ns | High-speed mode | 8 | ||
| Rise Time for Both SDA and SCL Signals | tF | 300 | ns | Fast mode; printed symbol tF | 8 | ||
| Rise Time for Both SDA and SCL Signals | tF | 160 | ns | High-speed mode; printed symbol tF | 8 | ||
| Fall Time for Both SDA and SCL Signals | tR | 300 | ns | Fast mode; printed symbol tR | 8 | ||
| Fall Time for Both SDA and SCL Signals | tR | 160 | ns | High-speed mode; printed symbol tR | 8 |
CAD (KiCad official)
- Symbol:
ADX111AMSOP10 - Footprint:
Package_SO:MSOP-10_3x3mm_P0.5mm - 3D model: MSOP-10 (KiCad packages3D, STEP)
- 3D model files:
adx111amsop10-etched.step/adx111amsop10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adx111amsop10.step/adx111amsop10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: analogysemi datasheet (39 pp, sha256
422090336f5853c9, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).