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BAS70-TP
Public Made by Adomby adom
MCC Micro Commercial Components Schottky Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBAS70-TP
MCC Micro Commercial Components · Schottky Diodes · SOT-23
BAS70-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the single Schottky diode (Figure 1, BAS70); VRRM 70 V, IF 70 mA at 25°C. |
| 2 | NC | unconnected | No internal connection in the single-diode BAS70 (Figure 1); no diode is drawn on this pin. |
| 3 | K | passive | Cathode of the single Schottky diode (Figure 1, BAS70); reverse breakdown 70 V min at 10 µA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | V(BR)R | 70 | V | Tested with 10µA pulse | 2 | ||
| Repetitive Peak Reverse Voltage | VRRM | 70 | V | 2 | |||
| Leakage Current | IR | 10 | 200 | nA | Pulse test tp < 300µs @ VR = 50 V | 2 | |
| Forward Voltage | VF | 410 | mV | tp < 300µs at IF = 1 mA | 2 | ||
| Forward Voltage | VF | 1000 | mV | tp < 300µs at IF = 40 mA | 2 | ||
| Reverse Recovery Time | trr | 5 | ns | IF = 10 mA through IR = 10 mA to IR = 1 mA | 2 | ||
| Total Capacitance | Ctot | 2 | pF | At VR = 0 V, F = 1 MHz | 2 | ||
| Thermal Resistance Junction to Ambient Air | RthJA | 430 | K/W | Junction to ambient air | 2 | ||
| Forward Continuous Current | IF | 70 | mA | Ta = 25°C | 1 | ||
| Surge Forward Current | IFSM | 100 | mA | tp < 1 s, Tamb = 25°C | 1 | ||
| Power Dissipation | 200 | mW | Tamb = 25°C | 1 | |||
| Operating Temperature | -55 | 125 | °C | 1 | |||
| Storage Temperature | -55 | 150 | °C | 1 |
CAD (KiCad official)
- Symbol:
BAS70-TP - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bas70-tp-etched.step/bas70-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bas70-tp.step/bas70-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC Micro Commercial Components datasheet (4 pp, sha256
eb808e0a8fa39faa, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).