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Contents

README

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BQ25890RTWR

Texas Instruments · Battery Management · WQFN-24-EP(4x4)

BQ25890RTWR from Texas Instruments, in a WQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBUS power_in Charger input voltage (3.9V to 14V) with integrated reverse-blocking MOSFET to PMID; place 1µF ceramic capacitor from VBUS to PGND close to IC.
2 D+ bidirectional USB data line positive for BC1.2 identification of charger type and adjustable high-voltage adapter detection.
3 D- bidirectional USB data line negative for BC1.2 identification of charger type and adjustable high-voltage adapter detection.
4 STAT output Open-drain charge status output pulled-HIGH externally; LOW indicates charging in progress, HIGH indicates charging complete or disabled.
5 SCL input I2C clock open-drain input; connect to logic rail (1.8V-3.3V) through 10kΩ pull-up resistor.
6 SDA bidirectional I2C data open-drain bidirectional line; connect to logic rail (1.8V-3.3V) through 10kΩ pull-up resistor.
7 INT output Open-drain interrupt output delivering active-LOW 256µs pulse for charger status changes and fault events; connect via 10kΩ pull-up.
8 OTG input Active-HIGH enable input for boost (OTG) mode; boost activates when OTG_CONFIG=1 and OTG pin HIGH.
9 CE input Active-LOW charge enable control input; charging enabled when CHG_CONFIG=1 and CE=LOW; must be pulled to logic level.
10 ILIM input Analog input for programmable input current limit; resistor from ILIM to GND sets maximum as IINMAX=KILIM/RILIM with 0.8V regulation threshold.
11 TS input Thermistor analog input for battery temperature monitoring with 103AT NTC thermistor; charge suspends outside configured temperature range.
12 QON input Battery FET control input with internal pull-up; LOW for 1s duration exits shipping mode, or LOW for 15s resets system when VBUS disconnected.
13 BAT power_in Battery positive terminal connection with integrated BATFET between BAT and SYS; place 10µF capacitor close to pin.
14 BAT power_in Battery positive terminal connection with integrated BATFET between BAT and SYS; place 10µF capacitor close to pin.
15 SYS power_out System output regulated above minimum voltage (3.0V-3.7V) by converter even with depleted battery; place 20µF capacitor close to pin.
16 SYS power_out System output regulated above minimum voltage (3.0V-3.7V) by converter even with depleted battery; place 20µF capacitor close to pin.
17 PGND power_in Power ground for high-current converter stages internally connected to LSFET source; connect directly to input/output capacitor grounds.
18 PGND power_in Power ground for high-current converter stages internally connected to LSFET source; connect directly to input/output capacitor grounds.
19 SW output PWM switching node connected to inductor output and LSFET source; place 0.047µF bootstrap capacitor from SW to BTST.
20 SW output PWM switching node connected to inductor output and LSFET source; place 0.047µF bootstrap capacitor from SW to BTST.
21 BTST power_out Bootstrap supply for high-side gate driver powered by internal bootstrap diode from SW node; connect 0.047µF bootstrap capacitor.
22 REGN power_out Internal LDO regulated output (5.6V-6.4V) powering gate drivers and TS bias; connect 4.7µF capacitor from REGN to analog GND close to IC.
23 PMID output Power management mid-point connected to RBFET drain and HSFET drain; place 1µF on VBUS-PGND and remaining input capacitance on PMID-PGND.
24 DSEL output Open-drain D+/D- detection multiplexer control output pulled-HIGH externally; driven LOW during D+/D- detection and held LOW for MaxCharge adapters.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-24-EP(4x4)
Category Power Management (PMIC)
Pins 25

CAD (KiCad official)

  • Symbol: BQ25890RTWR
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: WQFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: bq25890rtwr-etched.step / bq25890rtwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq25890rtwr.step / bq25890rtwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (70 pp, sha256 2e8c133466478bb3, retrieved 2026-09-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF