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Contents

README

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SY58237AGC

Silergy Corp · LED Drivers · DIP-8

SY58237AGC from Silergy Corp, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the device.
2 ISEN input Current set pin, where a resistor programs the reference output current; the current reference is 300 mV typical (294 to 306 mV) and the absolute maximum rating is -0.3 V to 3.6 V.
3 VSEN input Voltage sense pin, connected to a resistor divider from the inductor or auxiliary winding to sense output voltage; the absolute maximum rating is -0.3 V to 16 V and the reference voltage is 1.5 V.
4 VCC power_in Power supply pin, with a turn-on threshold of 14 V, a turn-off threshold of 7 V, and an absolute maximum rating of -0.3 V to 20 V.
5 LX passive Internal high-voltage MOSFET drain pin, rated for a breakdown voltage of 650 V with RDSON of 3.4 Ω.
6 LX passive Internal high-voltage MOSFET drain pin, rated for a breakdown voltage of 650 V with RDSON of 3.4 Ω.
7 LX passive Internal high-voltage MOSFET drain pin, rated for a breakdown voltage of 650 V with RDSON of 3.4 Ω.
8 LX passive Internal high-voltage MOSFET drain pin, rated for a breakdown voltage of 650 V with RDSON of 3.4 Ω.

Key specifications

Parameter Value
Manufacturer Silergy Corp
Package DIP-8
Category LED Drivers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ISEN pin voltage -0.3 3.6 V 3
VSEN pin voltage -0.3 16 V 3
VCC pin voltage -0.3 20 V 3
LX pin voltage (HV MOSFET drain) 650 V 3
Power dissipation DIP8 0.6 W TA = 25°C 3
Storage temperature range -65 150 °C 3
Lead temperature (soldering) 260 °C Soldering, 10 sec. 3
Package thermal resistance DIP8 junction-to-ambient θJA 68 °C/W Natural convection, TA = 25°C, JEDEC 51-3 board (Note 2) 3
Package thermal resistance DIP8 junction-to-case θJC 55 °C/W 3
Current Reference VISEN 294 300 306 mV 4

CAD (KiCad official)

  • Symbol: SY58237AGC
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: sy58237agc-etched.step / sy58237agc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sy58237agc.step / sy58237agc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Silergy Corp datasheet (5 pp, sha256 abc2ad7272b2130b, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF