component
HG1302N
Public Made by Adomby adom
HGSEMI Real Time Clocks, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHG1302N
HGSEMI · Real Time Clocks · DIP-8
HG1302N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC2 | power_in | Main supply pin for the dual-supply system; the HG1302 is powered from VCC2 when VCC2 exceeds VCC1 by more than 0.2V, and the recommended supply range is 2.0V to 5.5V. |
| 2 | X1 | passive | Connection for the 32.768kHz crystal, which should be selected for a load capacitance (CL) of 6pF. |
| 3 | X2 | passive | Connection for the 32.768kHz crystal, which should be selected for a load capacitance (CL) of 6pF. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | RST | input | Reset/enable input that must be driven high to start any data transfer, and driving it low aborts the transfer and forces I/O to high impedance; RST must be logic 0 until VCC is at least 2.5V at power-up, and SCLK must be logic 0 when RST is driven high. |
| 6 | I/O | bidirectional | Serial data input/output line; write data is sampled on the SCLK rising edge and read data is output on the falling edge, and the pin is tri-stated when RST is low. |
| 7 | SCLK | input | Serial clock input that synchronizes command, write and read transfers on the 3-wire interface. |
| 8 | VCC1 | power_in | Backup supply pin for battery or supercapacitor backup of the clock and RAM; the device is powered from VCC1 when VCC2 is not greater than VCC1 by 0.2V, and the recommended supply range is 2.0V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Clock/Timing |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Pin-to-ground voltage | VP | -0.5 | 7 | V | 3 | ||
| Operating temperature (HG1302) | TA | 0 | 70 | ℃ | HG1302 | 3 | |
| Storage temperature | TS | -55 | 125 | ℃ | 3 | ||
| Soldering temperature | TH | 260 | ℃ | 10 秒 | 3 | ||
| Supply voltage | VCC1，VCC2 | 2 | 5.5 | V | TA=0℃～70℃ | 3 | |
| Logic 1 input voltage | VIH | 2 | V | TA=0℃～70℃ | 3 | ||
| Logic 0 input voltage | VIL | -0.3 | 0.3 | V | TA=0℃～70℃; VCC=2.0V | 3 | |
| Logic 0 input voltage | VIL | -0.3 | 0.8 | V | TA=0℃～70℃; VCC=5V | 3 | |
| Input capacitance | CI | 10 | pF | TA=25℃ | 3 | ||
| I/O capacitance | CI/O | 15 | pF | TA=25℃ | 3 | ||
| Crystal oscillator capacitance | CX | 6 | pF | TA=25℃ | 3 | ||
| Input leakage current | ILI | 500 | μA | 0℃至70℃；VCC＝2.5V至5.5V | 3 | ||
| I/O leakage current | ILO | 500 | μA | 0℃至70℃；VCC＝2.5V至5.5V | 3 | ||
| Logic 1 output voltage | VOH | 1.6 | V | 0℃至70℃；VCC＝2.5V至5.5V; VCC=2.5V | 3 | ||
| Logic 1 output voltage | VOH | 2.4 | V | 0℃至70℃；VCC＝2.5V至5.5V; VCC=5V | 3 | ||
| Logic 0 output voltage | VOL | 0.4 | V | 0℃至70℃；VCC＝2.5V至5.5V; VCC=2.5V | 3 | ||
| Active supply current (VCC1) | ICC1A | 0.4 | mA | 0℃至70℃；VCC＝2.5V至5.5V; VCC1=2.5V | 3 | ||
| Active supply current (VCC1) | ICC1A | 1.2 | mA | 0℃至70℃；VCC＝2.5V至5.5V; VCC1=5V | 3 | ||
| Timekeeping current (VCC1) | ICC1T | 0.3 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC1=2.5V | 3 | ||
| Timekeeping current (VCC1) | ICC1T | 1 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC1=5V | 3 | ||
| Standby current (VCC1) | ICC1S | 100 | nA | 0℃至70℃；VCC＝2.5V至5.5V; VCC1=2.5V | 3 | ||
| Active supply current (VCC2) | ICC2A | 0.425 | mA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=2.5V | 4 | ||
| Active supply current (VCC2) | ICC2A | 1.28 | mA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=5V | 4 | ||
| Timekeeping current (VCC2) | ICC2T | 25.3 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=2.5V | 4 | ||
| Timekeeping current (VCC2) | ICC2T | 81 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=5V | 4 | ||
| Standby current (VCC2) | ICC2S | 25 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=2.5V | 4 | ||
| Standby current (VCC2) | ICC2S | 80 | μA | 0℃至70℃；VCC＝2.5V至5.5V; VCC2=5V | 4 | ||
| CLK to RST hold time | tcch | 240 | ns | VCC=2.5V | 4 | ||
| CLK to RST hold time | tcch | 60 | ns | VCC=5V | 4 | ||
| RST inactive time | tcwh | 4 | ns | VCC=2.5V | 4 | ||
| RST inactive time | tcwh | 1 | ns | VCC=5V | 4 | ||
| RST to I/O high-Z | tcdz | 280 | ns | VCC=2.5V | 4 | ||
| RST to I/O high-Z | tcdz | 70 | ns | VCC=5V | 4 | ||
| SCLK to I/O high-Z | tccz | 280 | ns | VCC=2.5V | 4 | ||
| SCLK to I/O high-Z | tccz | 70 | ns | VCC=5V | 4 | ||
| Data to CLK setup time | tdc | 200 | ns | VCC=2.5V | 4 | ||
| Data to CLK setup time | tdc | 50 | ns | VCC=5V | 4 | ||
| CLK to data hold time | tcdh | 280 | ns | VCC=2.5V | 4 | ||
| CLK to data hold time | tcdh | 70 | ns | VCC=5V | 4 | ||
| CLK to data delay | tcdd | 800 | ns | VCC=2.5V | 4 | ||
| CLK to data delay | tcdd | 200 | ns | VCC=5V | 4 | ||
| CLK low time | tcl | 1000 | ns | VCC=2.5V | 4 | ||
| CLK low time | tcl | 250 | ns | VCC=5V | 4 | ||
| CLK high time | tch | 1000 | ns | VCC=2.5V | 4 | ||
| CLK high time | tch | 250 | ns | VCC=5V | 4 | ||
| CLK frequency | tclk | 0.5 | MHz | VCC=2.5V | 4 | ||
| CLK frequency | tclk | 2 | MHz | VCC=5V | 4 | ||
| CLK rise and fall time | tr，tf | 2000 | ns | VCC=2.5V | 4 | ||
| CLK rise and fall time | tr，tf | 500 | ns | VCC=5V | 4 | ||
| RST to CLK setup time | tCC | 4 | µs | VCC=2.5V | 4 | ||
| RST to CLK setup time | tCC | 1 | µs | VCC=5V | 4 | ||
| Trickle charge resistance R1 | R1 | 2 | kΩ | 4 | |||
| Trickle charge resistance R2 | R2 | 4 | kΩ | 4 | |||
| Trickle charge resistance R3 | R3 | 8 | kΩ | 4 | |||
| Trickle charge diode forward drop | VTD | 0.7 | V | 4 |
CAD (KiCad official)
- Symbol:
HG1302N - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
hg1302n-etched.step/hg1302n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg1302n.step/hg1302n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
313dc8a655711ee6, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).