component
REF5040AQDRQ1
Public Made by Adomby adom
Texas Instruments Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownREF5040AQDRQ1
Texas Instruments · Voltage Reference · SOIC-8
REF5040AQDRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do not connect; this pin must not be used. |
| 2 | VIN | power_in | Input supply voltage, which must be at least VOUT + 0.2 V and no more than 18 V (absolute maximum 18 V). |
| 3 | TEMP | output | Temperature-dependent voltage output with approximately 60-kΩ source impedance; it is high impedance, so low-impedance loads cause measurement error and should be buffered. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | TRIM/NR | input | Trim and noise reduction pin providing a ±15-mV adjustment of VOUT; a capacitor to GND (1 µF suggested) forms a low-pass filter with the internal 1-kΩ resistor. |
| 6 | VOUT | output | Reference voltage output, capable of sourcing and sinking up to ±10 mA. |
| 7 | NC | unconnected | No internal connection; this pin must not be used. |
| 8 | DNC | unconnected | Do not connect; this pin must not be used. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial accuracy, standard grade | -0.1 | 0.1 | % | TA = 25°C, ILOAD = 0, CL = 1 μF, VIN = (VOUT + 0.2 V) to 18 V (table header) | 5 | ||
| Output voltage temperature drift, standard grade | dVOUT/dT | 3 | 8 | ppm/°C | Over temperature | 6 | |
| Line regulation (all devices except REF5020) | dVOUT/dVIN | 0.1 | 1 | ppm/V | VIN = VOUT + 0.2 V | 6 | |
| Line regulation, over temperature (all devices) | dVOUT/dVIN | 0.2 | 1 | ppm/V | Over temperature | 6 | |
| Load regulation (all devices except REF5020) | dVOUT/dILOAD | 20 | 30 | ppm/mA | -10 mA < ILOAD < +10 mA, VIN = VOUT + 0.75 V | 6 | |
| Load regulation, over temperature (all devices) | dVOUT/dILOAD | 50 | ppm/mA | Over temperature, -10 mA < ILOAD < +10 mA | 6 | ||
| Power supply, quiescent current | IQ | 0.8 | 1 | mA | TA = 25°C, ILOAD = 0, CL = 1 μF, VIN = (VOUT + 0.2 V) to 18 V (table header) | 6 | |
| Power supply, quiescent current, over temperature | IQ | 1.2 | mA | Over temperature | 6 | ||
| Specified temperature range | -40 | 125 | °C | 6 | |||
| Operating temperature range | -55 | 125 | °C | 6 | |||
| Power supply voltage | VS | 18 | V | See Note (1); printed minimum is VOUT + 0.2 V | 6 | ||
| Input voltage | 18 | V | 4 | ||||
| Output short-circuit | 30 | mA | 4 | ||||
| Operating temperature | -40 | 125 | °C | 4 | |||
| Junction temperature (TJ max) | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Supply input voltage | VIN | 18 | V | Minimum printed as VOUT + 0.2 V (footnote 1: 2.7 V for VOUT ≤ 2.5 V, not applicable) | 5 | ||
| Electrostatic discharge, human-body model (REF5020A-Q1, REF5040A-Q1, REF5050A-Q1 group) | V(ESD) | -500 | 500 | V | HBM per AEC Q100-002 | 4 | |
| Electrostatic discharge, charged-device model (REF5020A-Q1, REF5040A-Q1, REF5050A-Q1 group) | V(ESD) | -1000 | 1000 | V | CDM per AEC Q100-011 | 4 | |
| Electrostatic discharge, machine model (REF5020A-Q1, REF5040A-Q1, REF5050A-Q1 group) | V(ESD) | 200 | V | Machine model; printed as 200 without sign | 4 | ||
| Output voltage | VOUT | 4.096 | V | 5 | |||
| Output voltage noise | 12 | μVPP | f = 0.1 Hz to 10 Hz | 5 | |||
| Short-circuit current | ISC | 25 | mA | VOUT = 0 V | 6 | ||
| Voltage output, TEMP pin | 575 | mV | At TA = 25°C | 6 | |||
| Temperature sensitivity, TEMP pin | 2.64 | mV/°C | Over temperature | 6 | |||
| Turn-on settling time | 200 | μs | To 0.1% with CL = 1 μF | 6 | |||
| Thermal hysteresis, standard grade | 10 | ppm | Cycle 1 | 6 | |||
| Thermal hysteresis, standard grade | 5 | ppm | Cycle 2 | 6 | |||
| Long-term stability | 90 | ppm/1000 hr | 0 to 1000 hours | 6 | |||
| Long-term stability | 10 | ppm/1000 hr | 1000 to 2000 hours | 6 | |||
| Thermal resistance | 150 | °C/W | Listed under temperature range; no conditions printed | 6 | |||
| Junction-to-ambient thermal resistance | RθJA | 107.1 | °C/W | D (SOIC), 8 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 48.8 | °C/W | D (SOIC), 8 pins | 5 | ||
| Junction-to-board thermal resistance | RθJB | 48.3 | °C/W | D (SOIC), 8 pins | 5 | ||
| Junction-to-top characterization parameter | ψJT | 6.8 | °C/W | D (SOIC), 8 pins | 5 | ||
| Junction-to-board characterization parameter | ψJB | 47.6 | °C/W | D (SOIC), 8 pins | 5 |
CAD (KiCad official)
- Symbol:
REF5040AQDRQ1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ref5040aqdrq1-etched.step/ref5040aqdrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ref5040aqdrq1.step/ref5040aqdrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (26 pp, sha256
908e1bb3275e2398, retrieved 2026-10-10, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).